www.
DataSheet4U.
com SIGC18T60NC IGBT Chip in NPT-technology FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling C This chip is used for: • IGBT Modules Applications: • drives G E Chip Type SIGC18T60NC VCE 600V ICn 20A Die Size 4.
3 x 4.
3 mm2 Package sawn on foil Ordering Code Q67050-A4139A001 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 4.
3 x 4.
3 18.
49 / 14.
3 2.
48 x 2.
98 0.
7 x 1.
08 100 150 270 796...

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