IGBT Chip in NPT-technology FEATURES: • 600V NPT technology • 100µm chip • short circuit prove • positive temperature coefficient • easy paralleling SIGC25T60SNC This chip is used for: • SGP30N60 Applications: • drives C G E Chip Type SIGC25T60SNC SIGC25T60SNC VCE ICn Die Size 600V 30A 4.
5 x 5.
71 mm2 600V 30A 4.
5 x 5.
71 mm2 Package Ordering Code sawn on foil unsawn Q67041-A4667A001 Q67041-A4667A002 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environme...

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