www.
DataSheet4U.
com SIGC39T60 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling 3 This chip is used for: • power module • discrete components Applications: • drives C G E Chip Type SIGC39T60 VCE 600V ICn 75A Die Size 6.
59 x 5.
91 mm2 Package sawn on foil Ordering Code Q67050A4339-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Recommended storage enviro...

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