SIGC42T170R3GE IGBT3 Power Chip Features:  1700V Trench + Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power module Applications:  drives C G E Chip Type VCE ICn SIGC42T170R3GE 1700V 29A Die Size 6.
5 x 6.
46 mm2 Package sawn on foil MECHANICAL PARAMETER Raster size Emitter pad size (incl.
gate pad) Gate pad size Area total / active Thickness Wafer size Max.
possible chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size Recommended storage environment 6.
5 x 6.
46 4.
27 x 4.
27 1.
18 x 1.
09 mm2 42 / 28.
7 190 µm 200 mm 641 pcs Photoimi...

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