www.
DataSheet4U.
com Preliminary SIGC61T60NC IGBT Chip in NPT-technology FEATURES: • 600V NPT technology • 100µm chip • short circuit prove • positive temperature coefficient • easy paralleling C This chip is used for: • IGBT-Modules Applications: • drives G E Chip Type SIGC61T60NC VCE 600V ICn 75A Die Size 6.
99 x 8.
79 mm2 Package sawn on foil Ordering Code Q67050-A4160A001 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 6.
99 x 8.
79 61.
44 / 53.
7...

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