Part Number
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SIGC68T170R3 |
Manufacturer
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Infineon Technologies |
Description
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IGBT |
Published
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Sep 15, 2007 |
Detailed Description
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com
SIGC68T170R3
IGBT Chip
FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • sho...
|
Datasheet
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SIGC68T170R3
|
Overview
com
SIGC68T170R3
IGBT Chip
FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
3
This chip is used for: • power module
C
Applications: • drives
G
E
Chip Type SIGC68T170R3
VCE 1700V
ICn 50A
Die Size 8.
23 x 8.
25 mm2
Package sawn on foil
Ordering Code Q67050A4147-A001
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 8.
23 x 8.
25 4 x ( 2.
94 x ...
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