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BZT52C33


Part Number BZT52C33
Manufacturer LGE
Title 0.5W Zener Diodes
Description BZT52C2V4-BZT52C39 0.5W Zener Diodes SOD-123 Features — Planar Die Construction — 500mW Power Dissipation on Ceramic PCB — General Purpose, Medi...
Features — Planar Die Construction — 500mW Power Dissipation on Ceramic PCB — General Purpose, Medium Current — Ideally Suited for Automated Assembly Processes Mechanical Data — Case: SOD-123, Plastic — UL Flammability Classification Rating 94V-0 — Polarity: Cathode Band — Weight: 0.01 grams (approx.) 0.053...

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BZT52C30 : Features ■ Low zener impedance ■ Power dissipation: 500 mW ■ High stability and reliability Mechanical Data ■ SOD-123 small outline plastic package ■ Color band denotes cathode end ■ Mounting position: any BZT52Cxxx Series Surface Mount Zener Diodes Vz Range: 2.4 to 51V Power Dissipation: 500mW Package: SOD-123 Absolute Maximum Ratings (TA=25°C unless otherwise noted) Parameter Symbol Value Power Dissipation Forward Voltage @IF=10mA Junction Temperature Storage Temperature Range PD VF TJ TSTG 1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad area 25mm² 2) Short duration test pulse used to minimize self-heating effect 3) f=1KHz 500 1) 0.9 2) -65 to +150 -65 to +150 U.

BZT52C30 : ® WON-TOP ELECTRONICS Features  Planar Die Construction  500mW Power Dissipation  2.0V – 51V Nominal Zener Voltage  5% Standard Vz Tolerance  Designed for Surface Mount Application  Plastic Material – UL Recognition Flammability Classification 94V-0 C Mechanical Data  Case: SOD-123, Molded Plastic  Terminals: Plated Leads Solderable per MIL-STD-202, Method 208  Polarity: Cathode Band  Weight: 0.01 grams (approx.)  Marking: Device Code  Lead Free: For RoHS / Lead Free Version, Add “-LF” Suffix to Part Number, See Page 5 BZT52C2V0 – BZT52C51 500mW SURFACE MOUNT ZENER DIODE Pb A B E J D H G SOD-123 Dim Min Max A 3.6 3.9 B 2.5 2.8 C 1.4 1.8 D 0.5 0.7 E — 0.2 G 0.4 — H 0.95 1..

BZT52C30 : .

BZT52C30 : SMD Type Surface Mount Zener Diodes BZT52C2V0 - BZT52C39 Diodes Features Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10mA Jumction temperature Storage temperature Symbol P R JA VF Tj Tstg Rating 500 250 0.9 150 -65 to +150 Unit mW /W V Electrical Characteristics (Ta = 25 ) Type Zener voltage VZ (V) Maximum Zener Impedance Maximum Reverse Current Typical Temperature Coefficient @ IZTC mV/ Test Current IZTC Marking BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C.

BZT52C30 : www.vishay.com BZT52 Series Vishay Semiconductors Small Signal Zener Diodes 1 2 20278 MARKING (example only) X.Y = type code Y4 = date code X.Y Y4 23210 Cathode mark LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Models FEATURES • Silicon planar Zener diodes Available • The Zener voltages are graded according to the international E24 standard • AEC-Q101 qualified available • ESD capability according to AEC-Q101: Human body model 8 kV Machine model 800 V • Base P/N-E3, RoHS-compliant, commercial grade • Base P/N-HE3_A, RoHS-compliant, AEC-Q101 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRIMARY CHARACTERISTICS .

BZT52C30 : Forward Voltage Drop Power Dissipation Peak Forward Surge Current,8.3ms single half sine-wave superimposed on rated load (JEDEC method) Operating Junction Temperature Storage Temperature Range Value 0.9 410 2.0 150 -55 to 150 Unit Conditions V IF=10mA mW Ta=25 °C (Note 1) A (Note 2) °C °C Note: 1. Mounted on 5.0mm²(0.13mm thick ) land areas 2. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com Tel: (800)-TAITRON (800)-824-8766 (661)-257-6060 Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415 Rev. A/AH 2007-10-11 Page 1 of 4 410mW Two Terminals SMD Zener Diodes BZT52C2V4 -.

BZT52C30 : BZT52C2V4 - BZT52C75 Taiwan Semiconductor 500mW, 5% Tolerance SMD Zener Diodes FEATURES ● Wide zener voltage range selection: 2.4V to 75V ● VZ tolerance selection of ± 5% ● Surface mounting device (SMD) type ● Moisture sensitivity level: level 1, per J-STD-020 ● Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Low voltage stabilizers or voltage references ● Adapters ● On-board DC/DC converter MECHANICAL DATA ● Case: SOD-123F ● Molding compound meets UL 94 V-0 flammability rating ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Polarity: Indicated by cathode band ● Weight: 8.85 ± 0.5mg (approxi.

BZT52C30 : BZT52C2V0 - BZT52C51 Surface mount zener diode FEATURES z Planar die construction. z 500mW power dissipation on ceramic PCB. z General purpose, medium current. z Ideally suited for automated assembly processes. Pb Lead-free APPLICATIONS z Zener diode. z Ultra-small surface mount package. ORDERING INFORMATION SOD-123 Type No. Marking Package Code BZT52C2V4-BZT52C51 See table 2 SOD-123 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Value Unit Forward Voltage @ IF=10mA Power Dissipation Thermal resistance,junction to ambient air VF Pd RθjA 0.9 500 305 V mW ℃/W Junction temperature Tj 150 ℃ Storage temperature range Tstg -65-150 ℃ Notes: 1. .

BZT52C30 : BL Galaxy Electrical Production specification Surface mount zener diode FEATURES z Planar die construction. z 500mW power dissipation on ceramic PCB. z General purpose, medium current. Pb Lead-free z Ideally suited for automated assembly processes. BZT52C2V0-BZT52C51 APPLICATIONS z Zener diode. z Ultra-small surface mount package. SOD-123 ORDERING INFORMATION Type No. BZT52C2V4-BZT52C51 Marking See table 2 Package Code SOD-123 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Value Unit Forward Voltage @ IF=10mA Power Dissipation Thermal resistance,junction to ambient air VF Pd RθjA 0.9 500 305 V mW ℃/W Junction temperature Tj 150 ℃ Storage t.

BZT52C30 : Elektronische Bauelemente BZT52C Series 500mW SOD-123 Surface Mount Zener Diodes RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free FEATURES Standard Zener Breakdown Voltage Range: 2.4V to 43V Steady State Power Rating of 500 mW Small Body Outline Dimensions: 3.70 mm x 1.60 mm Low Body Height: 1.05 mm Package Weight: 10.00 mg / unit ESD Rating of Class 3 ( 16 KV ) per Human Body Model SOD-123 MECHANICAL DATA Case: SOD-123, Void-Free, Transfer-Molded Plastic. Finish: All External Surfaces are Corrosion Resistant. Maximum Case Temperature for Soldering Purpose: 260 ℃ for 10 Seconds Polarity: Cathode Indicated by Polarity Band Flammability Rating: UL94V-0 Mounting Posit.

BZT52C30 : MCC TM Micro Commercial Components   omponents 20736 Marilla Street Chatsworth    !"# $ %    !"# BZT52C2V4 THRU BZT52C51 Features x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant("P" Suffix designates RoHS Compliant. See ordering information) • Halogen free available upon request by adding suffix "-HF" Absolute Maximum Ratings Symbol PD TJ TSTG Rating Power dissipation Junction Temperature Storage Temperature Range Rating.

BZT52C30 : BZT52C2V4 ... BZT52C75 (500 mW) BZT52C2V4 ... BZT52C75 (500 mW) Surface mount Silicon Planar Zener Diodes Silizium-Planar-Zener-Dioden für die Oberflächenmontage Version 2015-03-10 1 .1 ±0.1 0 . 6 ± 0.1 Maximum power dissipation 2.7±0.1 Maximale Verlustleistung 0 .1 2 Nominal Z-voltage Nominale Z-Spannung 3 . 8±0.2 Plastic case 1 . ±06 .1 Type Kunststoffgehäuse Code Weight approx. Gewicht ca. Dimensions - Maße [mm] Standard packaging taped and reeled Standard Lieferform gegurtet auf Rolle 500 mW 3...75 V ~SOD-123 0.01 g Standard Zener voltage tolerance is graded to the international E 24 (~ ±5%) standard. Other voltage tolerances and higher Zener voltages on request. Die To.

BZT52C30 : FEATURES The BZT52C2V0~BZT52C75 are available in  SOD-123 Package.     Total power dissipation: Max. 500mW. Wide zener reverse voltage range 2.0V to 75V. Small plastic package suitable for surface mounted design. Tolerance approximately±5% Available in SOD-123 Package ORDERING INFORMATION Package Type Part Number BZT52C2V0 BZT52C13 BZT52C2V2 BZT52C15 BZT52C2V4 BZT52C16 BZT52C2V7 BZT52C18 BZT52C3V0 BZT52C20 BZT52C3V3 BZT52C22 BZT52C3V6 BZT52C24 BZT52C3V9 BZT52C27 BZT52C4V3 BZT52C30 SOD-123 BZT52C4V7 BZT52C33 BZT52C5V1 BZT52C36 BZT52C5V6 BZT52C39 BZT52C6V2 BZT52C43 BZT52C6V8 BZT52C47 BZT52C7V5 BZT52C51 BZT52C8V2 BZT52C56 BZT52C9V1 BZT52C62 BZT52C10 BZT52C68 BZ.

BZT52C30 : HITANO ENTERPRISE CORP. BZT52C2V4 THRU BZT52C39 TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position: Any * Weight: 0.008 gram Approx. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Dimensions in inches(mil.

BZT52C30 : BZT52C Series SILICON PLANAR ZENER DIODES Features • Ideally Suited for Automated Assembly Processes • Total power dissipation: max. 500 mW LL-34 Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Characteristics at Ta = 25 OC Parameter Thermal Resistance Junction to Ambient Air Forward Voltage at IF = 10 mA Symbol Ptot Tj TS Value 500 150 - 65 to + 150 Unit mW OC OC Symbol RthA VF Max. 305 0.9 Unit OC/mW V SEMTECH ELECTRONICS LTD. (Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724) ® Dated : 03/09/2007 BZT52C Series Characteristics at Ta = 25 OC Z.

BZT52C30 : Features  Planar Die Construction  500mW Power Dissipation  General Purpose, Medium Current  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Notes 3 & 4)  Qualified to AEC-Q101 Standards for High Reliability BZT52C2V0 - BZT52C51 SURFACE MOUNT ZENER DIODE Mechanical Data  Case: SOD123  Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208  Polarity: Cathode Band  Weight: 0.010 grams (Approximate).

BZT52C30 : Forward Voltage Drop @ IF 10mA Power Dissipation @ 25ºC Peak Forward Surge Current, 8.3ms Single Half Sine-WaveSuperimposed on Rated Load SYMBOL VF *PD **IFSM VALUE 0.9 410 2.0 UNIT V mW A Operating Junction and Storage Temperature Range Tj - 55 to +150 °C * Mounted on 5.0mm2 ( 0.13mm thick) land areas ** Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum ELECTRICAL CHARACTERISTICS (Ta=25°C unless specified otherwise) Zener Voltage Zener Impedance VF @ 10mA 0.9V Reverse Leakage Current Device # VZ @ IZT ZZT @ IZT ZZK @ IZK IR @ VR (V) (Ω) (mA) (Ω) (mA) (µA) (V) Marking Code min max max max max BZT52C 4V7 .




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