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LNK6778K

Power Integrations
Part Number LNK6778K
Manufacturer Power Integrations
Description High-Power Off-Line Switcher
Published Jan 18, 2020
Detailed Description LinkSwitch-HP Family Energy Efficient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR) Produc...
Datasheet PDF File LNK6778K PDF File

LNK6778K
LNK6778K

Overview
LinkSwitch-HP Family Energy Efficient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR) Product Highlights EcoSmart™- Energy Efficient • Multi-mode control maximizes efficiency over full load range • No-load consumption below 30 mW at 230 VAC (LNK67xx) • >75% efficiency with 1 W input at 230 VAC • >50% efficiency with 0.
1 W input at 230 VAC High Design Flexibility for Low System Cost • Dramatically simplifies power supply designs • Eliminates optocoupler and all secondary control circuitry • ±5% or better output voltage tolerance • 132 kHz operation reduces transformer and power supply size • Accurate programmable current limit • Compensation over line limits overload power • Frequency jittering reduces EMI filter cost • Fully integrated soft-start for minimum start-up stress • 725 V MOSFET simplifies meeting derating requirements (LNK677x) • 650 V MOSFET for lowest system cost (LNK676x/LNK666x) • Fast transient response family option (LNK666x) Extensive Protection Features • Auto-restart limits power delivery to 3% during overload faults • Output short-circuit protection (SCP) • Output overload/over-current protection (OPP, OCP) • Optional extended shutdown delay time • Output overvoltage protection (OVP), auto-restart or latching • Line brown-in/out protection (line UV) • Line overvoltage (OV) shutdown extends line surge withstand • Accurate thermal shutdown (OTP), hysteretic or latching Advanced Green Package Options • eSIP™-7C package: • Vertical orientation for minimum PCB footprint • Simple heat sink mounting using clip or adhesive pad • eSOP™-12B package: • Low profile surface mounted for ultra-slim designs • Heat transfer to PCB via exposed pad and SOURCE pins • Supports either wave or IR reflow soldering • eDIP™-12B package: • Low profile through-hole mounted for ultra-slim designs • Heat transfer to PCB via exposed pad or optional metal heat sink • Extended creepage to DRAIN pin • Heat sink is connected to SOURCE for low EMI • Hal...


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