BZT52C56 Datasheet PDF

BZT52 : The UTC BZT52 is a surface mount silicon Zener Diode using UTC’s advanced technology to provide customers with low power dissipation. The UTC BZT52 is universally applied in Automated Assembly Processes. „ FEATURES * Low Power Dissipation: 200mW * Zener Voltage (Typically 5.6V) * Planar Die construction „ ORDERING INFORMATION Ordering Number Lead Free Halogen Free BZT52L-CB2-R BZT52G-CB2-R Note: Pin Assignment: A: Anode, K: Cathode Package SOD-323 Pin Assignment 12 AK Packing Tape Reel „ MARKING PACKAGE MARKING SOD-323 T56 L: Lead Free G: Halogen Free www.unisonic.com.tw Copyright © 2012 Unisonic Technologies Co., Ltd 1 of 2 QW-R601-065.a BZT52 Preliminary DIODE „ ABSOLU.

BZT52-B10 : General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits • Total power dissipation: ≤ 590 mW • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • B selection • AEC-Q101 qualified 1.3 Applications • General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min [1] [2] [3] - [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated.

BZT52-B10 : BZT52-B2V0~BZT52-B36 SURFACE MOUNT ZENER DIODES FEATURES  PLANAR DIE CONSTRUCTION  POWER DISSIPATION  ZENER VOLTAGES FROM 2.0~36V  IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES  BOTH NORMAL AND Pb FREE PRODUCT ARE AVAILABLE: NORMAL: 80~95% Sn , 5~20%Pb Pb FREE: 98.5% Sn ABOVE MECHANICAL DATA  CASE:SOD-123,MOLDED PLASTIC  TERMINALS:SOLDERABLE PER MIL-STD-202, METHOD 208  Pb-Free：BZT52-B2V0~BZT52-B36 Halogen Free：BZT52-B2V0-H ~ BZT52-B36-H CASE：SOD-123 DIMENSIONS IN MILLIMETERS AND (INCHES) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED PARAMETER SYMBOL MAXIMUM FORWARD VOLTAGE DROP AT IF=10mA VF MAXIMUM POWER DISSI.

BZT52-B10-Q : General-purpose Zener diodes in an SOD123 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Total power dissipation: ≤ 590 mW • Two tolerance series: ±2 % and approximately ±5 % • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • Qualified according to AEC-Q101 and recommended for use in automotive applications 3. Applications • General regulation functions 4. Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min Typ Max Unit [1] - - 0.

BZT52-B10S : BZT52-B2V4S SERIES SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volt POWER 200 mWatt FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4~75V • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA • Case: SOD-323, Molded Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Apporx. Weight: 0.00014 ounces, 0.0041 grams 0.054(1.35) 0.045(1.15) 0.078(1.95) 0.068(1.75) 0.014(0.35) 0.009(0.25) 0.036(0.90) 0.027(0.70) 0.107(2.7) 0.090(2.3) 0.006(0.15) 0.002(0.05) 0.012(0.30)MIN. 1 Cathode 2 Anode MAXI.

BZT52-B11 : General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits • Total power dissipation: ≤ 590 mW • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • B selection • AEC-Q101 qualified 1.3 Applications • General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min [1] [2] [3] - [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated.

BZT52-B11 : BZT52-B2V0~BZT52-B36 SURFACE MOUNT ZENER DIODES FEATURES  PLANAR DIE CONSTRUCTION  POWER DISSIPATION  ZENER VOLTAGES FROM 2.0~36V  IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES  BOTH NORMAL AND Pb FREE PRODUCT ARE AVAILABLE: NORMAL: 80~95% Sn , 5~20%Pb Pb FREE: 98.5% Sn ABOVE MECHANICAL DATA  CASE:SOD-123,MOLDED PLASTIC  TERMINALS:SOLDERABLE PER MIL-STD-202, METHOD 208  Pb-Free：BZT52-B2V0~BZT52-B36 Halogen Free：BZT52-B2V0-H ~ BZT52-B36-H CASE：SOD-123 DIMENSIONS IN MILLIMETERS AND (INCHES) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED PARAMETER SYMBOL MAXIMUM FORWARD VOLTAGE DROP AT IF=10mA VF MAXIMUM POWER DISSI.

BZT52-B11-Q : General-purpose Zener diodes in an SOD123 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Total power dissipation: ≤ 590 mW • Two tolerance series: ±2 % and approximately ±5 % • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • Qualified according to AEC-Q101 and recommended for use in automotive applications 3. Applications • General regulation functions 4. Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min Typ Max Unit [1] - - 0.

BZT52-B11S : BZT52-B2V4S SERIES SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volt POWER 200 mWatt FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4~75V • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA • Case: SOD-323, Molded Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Apporx. Weight: 0.00014 ounces, 0.0041 grams 0.054(1.35) 0.045(1.15) 0.078(1.95) 0.068(1.75) 0.014(0.35) 0.009(0.25) 0.036(0.90) 0.027(0.70) 0.107(2.7) 0.090(2.3) 0.006(0.15) 0.002(0.05) 0.012(0.30)MIN. 1 Cathode 2 Anode MAXI.

BZT52-B12 : General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits • Total power dissipation: ≤ 590 mW • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • B selection • AEC-Q101 qualified 1.3 Applications • General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min [1] [2] [3] - [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated.

BZT52-B12 : BZT52-B2V0~BZT52-B36 SURFACE MOUNT ZENER DIODES FEATURES  PLANAR DIE CONSTRUCTION  POWER DISSIPATION  ZENER VOLTAGES FROM 2.0~36V  IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES  BOTH NORMAL AND Pb FREE PRODUCT ARE AVAILABLE: NORMAL: 80~95% Sn , 5~20%Pb Pb FREE: 98.5% Sn ABOVE MECHANICAL DATA  CASE:SOD-123,MOLDED PLASTIC  TERMINALS:SOLDERABLE PER MIL-STD-202, METHOD 208  Pb-Free：BZT52-B2V0~BZT52-B36 Halogen Free：BZT52-B2V0-H ~ BZT52-B36-H CASE：SOD-123 DIMENSIONS IN MILLIMETERS AND (INCHES) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED PARAMETER SYMBOL MAXIMUM FORWARD VOLTAGE DROP AT IF=10mA VF MAXIMUM POWER DISSI.

BZT52-B12-Q : General-purpose Zener diodes in an SOD123 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Total power dissipation: ≤ 590 mW • Two tolerance series: ±2 % and approximately ±5 % • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • Qualified according to AEC-Q101 and recommended for use in automotive applications 3. Applications • General regulation functions 4. Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min Typ Max Unit [1] - - 0.

BZT52-B12S : BZT52-B2V4S SERIES SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volt POWER 200 mWatt FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4~75V • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA • Case: SOD-323, Molded Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Apporx. Weight: 0.00014 ounces, 0.0041 grams 0.054(1.35) 0.045(1.15) 0.078(1.95) 0.068(1.75) 0.014(0.35) 0.009(0.25) 0.036(0.90) 0.027(0.70) 0.107(2.7) 0.090(2.3) 0.006(0.15) 0.002(0.05) 0.012(0.30)MIN. 1 Cathode 2 Anode MAXI.

BZT52-B13 : General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits • Total power dissipation: ≤ 590 mW • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • B selection • AEC-Q101 qualified 1.3 Applications • General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min [1] [2] [3] - [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated.

BZT52-B13 : BZT52-B2V0~BZT52-B36 SURFACE MOUNT ZENER DIODES FEATURES  PLANAR DIE CONSTRUCTION  POWER DISSIPATION  ZENER VOLTAGES FROM 2.0~36V  IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES  BOTH NORMAL AND Pb FREE PRODUCT ARE AVAILABLE: NORMAL: 80~95% Sn , 5~20%Pb Pb FREE: 98.5% Sn ABOVE MECHANICAL DATA  CASE:SOD-123,MOLDED PLASTIC  TERMINALS:SOLDERABLE PER MIL-STD-202, METHOD 208  Pb-Free：BZT52-B2V0~BZT52-B36 Halogen Free：BZT52-B2V0-H ~ BZT52-B36-H CASE：SOD-123 DIMENSIONS IN MILLIMETERS AND (INCHES) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED PARAMETER SYMBOL MAXIMUM FORWARD VOLTAGE DROP AT IF=10mA VF MAXIMUM POWER DISSI.

BZT52-B13-Q : General-purpose Zener diodes in an SOD123 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Total power dissipation: ≤ 590 mW • Two tolerance series: ±2 % and approximately ±5 % • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • Qualified according to AEC-Q101 and recommended for use in automotive applications 3. Applications • General regulation functions 4. Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min Typ Max Unit [1] - - 0.

BZT52-B13S : BZT52-B2V4S SERIES SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volt POWER 200 mWatt FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4~75V • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA • Case: SOD-323, Molded Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Apporx. Weight: 0.00014 ounces, 0.0041 grams 0.054(1.35) 0.045(1.15) 0.078(1.95) 0.068(1.75) 0.014(0.35) 0.009(0.25) 0.036(0.90) 0.027(0.70) 0.107(2.7) 0.090(2.3) 0.006(0.15) 0.002(0.05) 0.012(0.30)MIN. 1 Cathode 2 Anode MAXI.