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PLCC20

ST Microelectronics
Part Number PLCC20
Manufacturer ST Microelectronics
Description PLCC 20
Published May 12, 2005
Detailed Description ® Thermal Data PLCC 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01...
Datasheet PDF File PLCC20 PDF File

PLCC20
PLCC20

Overview
® Thermal Data PLCC 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.
61 W/cm°C 0.
01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.
25 mm 10-40 µm molding compound 3.
6 mm 0.
0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace area 3) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data Rth(j-a) (ºC/W) 180 die pad = 140 x 140 sq.
mils die size = 80 x 120 sq.
mils PLCC 20 160 140 floating in air 1) 120 100 mounted on SM PCB5A board 80 mounted on SM PCB5 board 0 0.
2 0.
4 0.
6 0.
8 1 1.
2 dissipated power ( Watt ) 1.
4 1.
6 1.
8 2 Rth(j-a) (ºC/W) 105 die size =...


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