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DIP40

STMicroelectronics
Part Number DIP40
Manufacturer STMicroelectronics
Description Thermal Data
Published Jun 3, 2005
Detailed Description  Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 ...
Datasheet PDF File DIP40 PDF File

DIP40
DIP40

Overview
 Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.
61 W/cm°C 0.
01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.
25 mm 10-40 µm molding compound 3.
8 mm 0.
0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data Dip 40 Rth(j-a) (ºC/W) 65 1) 60 die size 35000 sq.
mils dissipating area 2000 sq.
mils 2 s 1 Oz.
board 55 50 0 0.
5 1 1.
5 dissipated power ( Watt ) 2 2.
5 3 Zth( ºC/W) 2) 10 die size 35000 sq.
mils dissipating area 2000 sq.
mils 2s 1Oz.
board 2 w single square pulse 0.
001 0.
01 0.
1 1 Time (s) 10 100 1,000 2/2  ...


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