DatasheetsPDF.com

AN830

Microchip
Part Number AN830
Manufacturer Microchip
Description RFID Tag and COB Development Guide
Published May 15, 2014
Detailed Description AN830 RFID Tag and COB Development Guide with Microchip’s RFID Devices Author: Youbok Lee, Ph.D. Microchip Technology In...
Datasheet PDF File AN830 PDF File

AN830
AN830

Overview
AN830 RFID Tag and COB Development Guide with Microchip’s RFID Devices Author: Youbok Lee, Ph.
D.
Microchip Technology Inc.
Since the direct die att achment reduces a step for making the COB package, it is widely used for low cost and high volume applications such as smart labels.
The direct die att achment can be achieved with two dif ferent methods: (a) wire bonding or (b) flip-chip with bumped die.
For the flip-chip, it needs a special bumping on the die’s bond pads.
Typically the bump material is made of gold with approximately 25 um of height.
The flip-chip assembly process att aches the bumped area to the antenna tr aces.
Several bumping and flip chip assembly methods are available for RFID t ags.
The wire bonding method needs a relatively simple process for the die attachment.
The die is directly wirebonded to the antenna, and covers the wire bonded area with a black colored epoxy glob top.
For small volume pr oduction, the wir e-bonding method is still les s expensive than using...


Similar Datasheet


Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)