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MT7830

Maxic Technology
Part Number MT7830
Manufacturer Maxic Technology
Description Non-isolated APFC BUCK LED Driver
Published Aug 30, 2015
Detailed Description Maximizing IC Performance MT7830 Non-isolated APFC BUCK LED Driver DESCRIPTION The MT7830 is a high-PF, non-isolate LE...
Datasheet PDF File MT7830 PDF File

MT7830
MT7830

Overview
Maximizing IC Performance MT7830 Non-isolated APFC BUCK LED Driver DESCRIPTION The MT7830 is a high-PF, non-isolate LED Driver IC.
The floating-ground, high-side BUCK topology makes full wave detection possible.
The MT7830 works in QRM mode, which improves both of efficiency and EMI performance.
Selectable maximum period control is integrated, such that flick can be eliminated while enough demagnetization time is guaranteed.
Various protections such as OVP, OCP, OTP, etc, are embedded to improve reliability.
The driving capability of the MT7830 is designed to be insensitive to VDD voltage and soft, with MAXIC proprietary technique.
It can help to improve EMI performance greatly.
FEATURES  Single-stage active power factor correction (PFC > 0.
90)  High accurate LED current (+/-3%)  Good Line and Load Regulation (+/-2%)  Quasi-Resonant mode (QRM) operation  Various protection schemes.
 Power-on soft-start  Compact package: SOP8 APPLICATIONS  E27/PAR30/PAR38/GU10 lamp  T8/T10 LED tube  Other LED lighting applications Typical Application Circuit MT7830 Rev.
1.
25 www.
maxictech.
com Copyright © 2014 Maxic Technology Corporation Page 1 Maximizing IC Performance ABSOLUTE MAXIMUM RATINGS VDD Pin Voltage COMP/CS/DSEN Pin Voltage Lead Temperature (soldering, 10 sec.
) PDMAX(maximum power consumption) Storage Temperature MT7830 Non-isolated APFC BUCK LED Driver -0.
3V to VDD Clamp -0.
3V to 5V 260°C 0.
8W -55°C to 150°C Recommended operating conditions Supply voltage Operating Temperature (Environment) Thermal resistance① 9V to 28V -40°C to 105°C Junction to ambient (RθJA) 128°C/W Note: ① RθJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of JEDEC 51-3 thermal measurement standard.
Test condition: Device mounted on 2” X 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.
PIN CONFIGURATIONS Chip Mark MT7830 YY WW xx...


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