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XC2VP40

Part Number	XC2VP40
Manufacturer	Xilinx
Description	Virtex-II Pro and Virtex-II Pro X Platform FPGAs
Published	Oct 12, 2015
Detailed Description	Product Not Recommended For New Designs 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet DS08...
Datasheet	XC2VP40 PDF File

Overview

Product Not Recommended For New Designs 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet DS083 (v5.
0) June 21, 2011 0 Product Specification Module 1: Introduction and Overview 10 pages • Summary of Features • General Description • Architecture • IP Core and Reference Support • Device/Package Combinations and Maximum I/O • Ordering Information Module 2: Functional Description 60 pages • Functional Description: RocketIO™ X Multi-Gigabit Transceiver • Functional Description: RocketIO Multi-Gigabit Transceiver • Functional Description: Processor Block • Functional Description: PowerPC™ 405 Core • Functional Description: FPGA - Input/Output Blocks (IOBs) - Digitally Controlled Impedance (DCI) - On-Chip Differential Termination - Configurable Logic Blocks (CLBs) - 3-State Buffers - CLB/Slice Configurations - 18-Kb Block SelectRAM™ Resources - 18-Bit x 18-Bit Multipliers - Global Clock Multiplexer Buffers - Digital Clock Manager (DCM) • Routing • Configuration Module 3: DC and Switching Characteristics 59 pages • Electrical Characteristics • Performance Characteristics • Switching Characteristics • Pin-to-Pin Output Parameter Guidelines • Pin-to-Pin Input Parameter Guidelines • DCM Timing Parameters • Source-Synchronous Switching Characteristics Module 4: Pinout Information 302 pages • Pin Definitions • Pinout Tables - FG256/FGG256 Wire-Bond Fine-Pitch BGA Package - FG456/FGG456 Wire-Bond Fine-Pitch BGA Package - FG676/FGG676 Wire-Bond Fine-Pitch BGA Package - FF672 Flip-Chip Fine-Pitch BGA Package - FF896 Flip-Chip Fine-Pitch BGA Package - FF1148 Flip-Chip Fine-Pitch BGA Package - FF1152 Flip-Chip Fine-Pitch BGA Package - FF1517 Flip-Chip Fine-Pitch BGA Package - FF1696 Flip-Chip Fine-Pitch BGA Package - FF1704 Flip-Chip Fine-Pitch BGA Package IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end.
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