Zener Diodes. 1N5544BUR-1 Datasheet

1N5544BUR-1 Datasheet PDF


Part Number

1N5544BUR-1

Description

Low Voltage Avalanche 500mW Zener Diodes

Manufacture

Microsemi

Total Page 6 Pages
Datasheet
Download 1N5544BUR-1 Datasheet


1N5544BUR-1
1N5518BUR-1 thru 1N5546BUR-1
Available on
commercial
versions
Low Voltage Avalanche
500 mW Zener Diodes
Qualified per MIL-PRF-19500/437
DESCRIPTION
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface mount Zener voltage
regulators provides a selection from 3.3 to 33 volts with tolerances ranging from plus/minus
1% to 20%. The standard tolerance is plus/minus 5% with the B suffix unless ordered
otherwise. These glass surface mount devices are available with an internal metallurgical
bond option. This type of bonded Zener package construction is also in JAN, JANTX, and
JANTXV military qualifications. Microsemi also offers numerous other Zener products to meet
higher and lower power applications.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
JEDEC registered 1N5518 thru 1N5546.
Voltage tolerances of plus/minus 20%, 10%, 5%, 2%, and 1% available. See Note 1 on page 3.
Internal metallurgical bond.
JAN, JANTX, and JANTXV qualification per MIL-PRF-19500/437 available.
RoHS compliant versions available (commercial grade only).
Qualified Levels:
JAN, JANTX and
JANTXV
DO-213AA MELF
Package
Also available in:
DO-35 (DO-204AH)
(axial-leaded)
1N5518B-1 thru 1N5546B-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Extensive selection from 3.3 to 33 V.
Hermetically sealed surface mount package.
Nonsensitive to ESD per MIL-STD-750 Method 1020.
Minimal capacitance (see Figure 3).
Inherently radiation hard as described in Microsemi’s “MicroNote 050” which is available at
Microsemi.com.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Steady-State Power (Note 1)
(Also see derating in Figure 2)
Thermal Resistance Junction-to-End Cap (Note 2)
Thermal Resistance Junction-to-Ambient (Note 2)
Thermal Impedance
Forward Voltage 200mA
Solder Pad Temperature @ 10 s
Symbol
TJ and TSTG
PD
R ӨJEC
R ӨJA
Z ӨJX
VF
T SP
Value
-65 to +175
0.5
100
300
35
1.1
260
Unit
oC
W
oC/W
oC/W
oC/W
V
oC
Notes: 1. At end cap temperature TEC < 125 oC or at ambient TA < 50 ºC when mounted on FR4 PC board as
described for thermal resistance above (see Figure 2 for derating). Derate to 0 at +175 oC.
2. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
T4-LDS-0037, Rev 2 (111456)
©2011 Microsemi Corporation
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Page 1 of 6

1N5544BUR-1
1N5518BUR-1 thru 1N5546BUR-1
MECHANICAL and PACKAGING
CASE: Hermetically sealed glass DO-213AA (SOD80 or MLL34) MELF style package.
TERMINALS: End caps tin-lead plated or RoHS compliant matte-Tin plating available (on commercial only) solderable per MIL-
STD-750, method 2026.
POLARITY: Cathode indicated by band where diode is to be operated with the banded end positive with respect to the opposite
end for Zener regulation.
MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) of this device is approximately +6 PPM/oC. The
COE of the Mounting Surface System should be selected to provide a suitable match with this device.
MARKING: cathode band only.
TAPE & REEL option: Standard per EIA-481-1-A with 12 mm tape (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: 0.04 grams.
See Package Dimensions on last page.
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
Blank = Commercial
JEDEC type number
See Electrical Characteristics
table
Zener Voltage Tolerance
A = 10%
B = 5%
C = 2%
D = 1%
Blank = 20%
PART NOMENCLATURE
JAN 1N5518 B UR -1 (e3)
RoHS Compliance
e3 = RoHS compliant (available
on commercial grady only)
Blank = non-RoHS compliant
Metallurgical Bond
-1 = Metallurgical bond
Package type
UR = surface mount
Symbol
IR
IZ, IZT, IZK
I ZL
I ZM
VZ
V Z
ZZT or ZZK
SYMBOLS & DEFINITIONS
Definition
Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature.
Regulator Current: The dc regulator current (IZ), at a specified test point (IZT), near breakdown knee (IZK).
Low Regulator (Zener) Current: The lowest rated dc current for the specified power rating.
Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
Zener Voltage: The zener voltage the device will exhibit at a specified current (IZ) in its breakdown region.
Voltage Regulation: The change in zener voltage between two specified currents or percentage of IZM.
Dynamic Impedance: The small signal impedance of the diode when biased to operate in its breakdown region at a
specified rms current modulation (typically 10% of IZT or IZK) and superimposed on IZT or IZK respectively.
T4-LDS-0037, Rev 2 (111456)
©2011 Microsemi Corporation
Page 2 of 6





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