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29F32G08 Module Datasheet PDF

NAND Flash Module

NAND Flash Module

 

 

 

Part Number 29F32G08
Description NAND Flash Module
Feature NAND Flash Module 29F32G08 Preliminary FEATURES: NAND Flash Interface Single Level Cell (SLC) Technology ONFI 2.
2 Co mpliant Operating Voltage VCC 3.
0 - 3.
6 V VCCQ 1.
7 - 1.
95V or 3.
0-3.
6V High den sity 32Gbit per FLASH NAND die Supports higher speed designs with less capacit ance/fewer I/O's to drive Page Size 864 0 bytes (8192 + 448 spare bytes) Suppor ts external BCH correction algorithms ( 16 bit correction per 540 bytes) Featur es High reliability data storage for de manding space applications Ceramic herm etic package with built-in TID shieldin g Class E, I, B or S Speed Can be used in asynch or s .
Manufacture Maxwell
Datasheet
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29F32G08

 

 

 


 

 

 

Part Number 29F32G08C
Description NAND Flash Memory
Feature www.
DataSheet.
co.
kr www.
DataSheet4U.
net Micron Confidential and Proprietary 3 2Gb, 64Gb, 128Gb, 256Gb Asynchronous/Sy nchronous NAND Features NAND Flash Mem ory MT29F32G08CBABA, MT29F64G08C[E/F]AB A, MT29F128G08C[J/K/M]ABA, MT29F256G08C UABA, MT29F32G08CBABB, MT29F32G08CBCBB, MT29F64G08CFABB, MT29F64G08CECBB, MT29 F128G08CJABB, MT29F128G08C[K/M]CBB, MT2 9F256G08CUCBB Features
• Open NAND Fl ash Interface (ONFI) 2.
1-compliant1
• Multiple-level cell (MLC) technology Organization – Page size x8: 4320 bytes (4096 + 224 bytes) – Block size : 256 pages (1024K + 56K bytes) – Pla ne size: 2 planes x 2048 b .
Manufacture Micron
Datasheet
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29F32G08C

 

 

 


 

 

 

Part Number 29F32G08
Description NAND Flash Module
Feature NAND Flash Module 29F32G08 Preliminary FEATURES: NAND Flash Interface Single Level Cell (SLC) Technology ONFI 2.
2 Co mpliant Operating Voltage VCC 3.
0 - 3.
6 V VCCQ 1.
7 - 1.
95V or 3.
0-3.
6V High den sity 32Gbit per FLASH NAND die Supports higher speed designs with less capacit ance/fewer I/O's to drive Page Size 864 0 bytes (8192 + 448 spare bytes) Suppor ts external BCH correction algorithms ( 16 bit correction per 540 bytes) Featur es High reliability data storage for de manding space applications Ceramic herm etic package with built-in TID shieldin g Class E, I, B or S Speed Can be used in asynch or s .
Manufacture Maxwell
Datasheet
Download 29F32G08 Datasheet

29F32G08

 

 

 

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