Features
• High forward current transfer ratio hFE
• I type package enabling direct soldering of the radiating fin to the printed circuit board, etc.of small electronic equipment
12.6±0.3 7.2±0.3
7.0±0.3 3.0±0.2 2.0±0.2
3.5±0.2
0˚ to 0.15˚
2.5±0.2
(1.0)
...
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