LED. AAAF5051-04 Datasheet

AAAF5051-04 Datasheet PDF

Part AAAF5051-04
Description SMD LED
Feature ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features z Chip.
Manufacture Kingbright
Datasheet
Download AAAF5051-04 Datasheet

ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DIS AAAF5051-04 Datasheet





AAAF5051-04
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features
z Chips can be controlled separately.
z Suitable for all SMT assembly and solder process.
z Available on tape and reel.
z White SMD package, silicone resin.
z Package: 500pcs / reel.
z Moisture sensitivity level : level 3.
z RoHS compliant.
Package Dimensions
5.0mm x 5.0mm FULL-COLOR SURFACE
MOUNT LED LAMP
Part Number: AAAF5051-04
Blue
Reddish-Orange
Green
Descriptions
z The Blue source color devices are made with InGaN on
Al2O3 substrate Light Emitting Diode.
z The Reddish-Orange source color devices are made with
AlGaInP on AlN substrate Light Emitting Diode.
z The Green source color devices are made with InGaN on
Al2O3 substrate Light Emitting Diode.
z Electrostatic discharge and power surge could damage
the LEDs.
z It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs.
z All devices, equipments and machineries must be
electrically grounded.
R
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.15[±0.006]unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAM7047
APPROVED: WYNEC
REV NO: V.4B
CHECKED: Allen Liu
DATE: SEP/16/2014
DRAWN: L.Q.Xie
PAGE: 1 OF 9
ERP : 1201008410



AAAF5051-04
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAM7047
APPROVED: WYNEC
REV NO: V.4B
CHECKED: Allen Liu
DATE: SEP/16/2014
DRAWN: L.Q.Xie
PAGE: 2 OF 9
ERP : 1201008410




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