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Preliminary Technical Data
KEY FEATURES
Up to 600 MHz, 1.67 ns Instruction Cycle Rate 24M Bits of Internal—On-Chip—DRAM Memory 25×25 mm (576-Ball) Thermally Enhanced Ball Grid Array Package Dual Computation Blocks—Each Containing an ALU, a Multiplier, a Shifter, a Register File, and a Communications Logic Unit (CLU) Dual Integer ALUs, pr...
