PROCESS
Small Signal Transistor
NPN - Low Noise Amplifier Transistor Chip
CP188
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area
www.DataSheet4U.com
EPITAXIAL PLANAR 15 x 15 MILS 9.0 MILS 4.0 x 4.0 MILS 5.5 x 5.5 MILS Al - 30,000Å Au - 18,000Å
Emitter Bonding Pad Area Top Side Metalization Back Side ...
