Power Stage. CSD97395Q4M Datasheet

CSD97395Q4M Datasheet PDF


Part Number

CSD97395Q4M

Description

Synchronous Buck NexFET Power Stage

Manufacture

etcTI

Total Page 22 Pages
Datasheet
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CSD97395Q4M
SLPS541A – DECEMBER 2014 – REVISED MARCH 2015
CSD97395Q4M Synchronous Buck NexFET™ Power Stage
1 Features
1 Over 92% System Efficiency at 15 A
• Max Rated Continuous Current 25 A, Peak 60 A
• High Frequency Operation (up to 2 MHz)
• High Density – SON 3.5 mm × 4.5 mm Footprint
• Ultra-Low Inductance Package
• System-Optimized PCB Footprint
• Ultra-Low Quiescent (ULQ) Current Mode
• 3.3 V and 5 V PWM Signal Compatible
• Diode Emulation Mode With FCCM
• Input Voltages up to 24 V
• Tri-State PWM Input
• Integrated Bootsrap Diode
• Shoot Through Protection
• RoHS Compliant – Lead Free Terminal Plating
• Halogen Free
2 Applications
• Ultrabook/Notebook DC/DC Converters
• Multiphase Vcore and DDR Solutions
• Point-of-Load Synchronous Buck in Networking,
Telecom, and Computing Systems
3 Description
The CSD97395Q4M NexFET™ Power Stage is a
highly optimized design for use in a high-power, high-
density synchronous buck converter. This product
integrates the driver IC and NexFET technology to
complete the power stage switching function. The
driver IC has a built-in selectable diode emulation
function that enables DCM operation to improve light
load efficiency. In addition, the driver IC supports
ULQ mode that enables connected standby for
Windows® 8. With the PWM input in tri-state,
quiescent current is reduced to 130 µA, with
immediate response. When SKIP# is held at tri-state,
the current is reduced to 8 µA (typically 20 µs is
required to resume switching). This combination
produces a high current, high efficiency, and high
speed switching device in a small 3.5 × 4.5 mm
outline package. In addition, the PCB footprint is
optimized to help reduce design time and simplify the
completion of the overall system design.
Device Information(1)
ORDER NUMBER
PACKAGE
MEDIA AND QTY
CSD97395Q4M
CSD97395Q4MT
SON 3.5 × 4.5 mm
Plastic Package
13-inch reel 2500
7-inch reel 250
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
SPACER
Application Diagram
Typical Power Stage Efficiency and Power Loss
VIN 100
12
CSD97395
VCC
VOUT
VCC
PWM1
+Is1
VOUT
-Is2
+NTC
SS -NTC
RT +Is2
-Is2
PWM2
PGND
Multi-Phase
Controller
1
CSD97395
VOUT
90
80
70
60
VDD = 5 V
VIN = 12 V
VOUT = 1.8 V
LOUT = 0.29 2H
fSW = 500 kHz
TA = 25GC
10
8
6
4
50 2
40 0
0 5 10 15 20 25
Output Current (A)
D001
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

CSD97395Q4M
CSD97395Q4M
SLPS541A – DECEMBER 2014 – REVISED MARCH 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
7 Detailed Description .............................................. 6
7.1 Overview ................................................................... 6
7.2 Functional Block Diagram ......................................... 6
7.3 Feature Description................................................... 6
7.4 Device Functional Modes.......................................... 8
8 Application and Implementation .......................... 9
8.1 Application Information.............................................. 9
8.2 Typical Application ................................................... 9
8.3 System Example ..................................................... 11
9 Layout ................................................................... 14
9.1 Layout Guidelines ................................................... 14
9.2 Layout Example ...................................................... 14
9.3 Thermal Considerations .......................................... 14
10 Device and Documentation Support ................. 15
10.1 Trademarks ........................................................... 15
10.2 Electrostatic Discharge Caution ............................ 15
10.3 Glossary ................................................................ 15
11 Mechanical, Packaging, and Orderable
Information ........................................................... 16
11.1 Mechanical Drawing.............................................. 16
11.2 Recommended PCB Land Pattern........................ 17
11.3 Recommended Stencil Opening ........................... 17
4 Revision History
Changes from Original (December 2014) to Revision A
Page
Figure 11 updated to show normalized Power Loss vs. Output Inductance ........................................................................ 11
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