Converter. DAC6311 Datasheet

DAC6311 Datasheet PDF

Part DAC6311
Description D/A Converter
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DAC6311
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
DAC5311, DAC6311, DAC7311
SBAS442C – AUGUST 2008 – REVISED JULY 2015
DACx311 2-V to 5.5-V, 80-µA, 8-, 10-, and 12-Bit, Low-Power, Single-Channel,
Digital-to-Analog Converters in SC70 Package
1 Features
1 Relative Accuracy:
– 0.25 LSB INL (DAC5311: 8-Bit)
– 0.5 LSB INL (DAC6311: 10-Bit)
– 1 LSB INL (DAC7311: 12-Bit)
microPower Operation: 80 μA at 2.0 V
• Power-Down: 0.5 μA at 5 V, 0.1 μA at 2.0 V
• Wide Power Supply: 2.0 V to 5.5 V
• Power-On Reset to Zero Scale
• Straight Binary Data Format
• Low Power Serial Interface With Schmitt-
Triggered Inputs: up to 50 MHz
• On-Chip Output Buffer Amplifier, Rail-to-Rail
Operation
• SYNC Interrupt Facility
• Extended Temperature Range –40°C to +125°C
• Pin-Compatible Family in a Tiny, 6-Pin SC70
Package
2 Applications
• Portable, Battery-Powered instruments
• Process Controls
• Digital Gain and Offset Adjustment
• Programmable Voltage and Current Sources
Simplified Schematic
AVDD GND
Power-On
Reset
DAC
Register
REF(+)
8-/10-/12-Bit
DAC
Output
Buffer
VOUT
Input Control
Logic
Power-Down
Control Logic
Resistor
Network
3 Description
The DAC5311 (8-bit), DAC6311 (10-bit), and
DAC7311 (12-bit) devices are low-power, single-
channel, voltage output digital-to-analog converters
(DACs). The low power consumption of these devices
in normal operation (0.55 mW at 5 V, reducing to 2.5
μW in power-down mode) makes it ideally suited for
portable, battery-operated applications.
These devices are monotonic by design, provide
excellent linearity, and minimize undesired code-to-
code transient voltages while offering an easy
upgrade path within a pin-compatible family. All
devices use a versatile, three-wire serial interface that
operates at clock rates of up to 50 MHz and is
compatible with standard SPI™, QSPI™, Microwire,
and digital signal processor (DSP) interfaces.
All devices use an external power supply as a
reference voltage to set the output range. The
devices incorporate a power-on reset (POR) circuit
that ensures the DAC output powers up at 0 V and
remains there until a valid write to the device occurs.
The DAC5311, DAC6311, and DAC7311 contain a
power-down feature, accessed over the serial
interface, that reduces current consumption of the
device to 0.1 μA at 2.0 V in power-down mode.
These devices are pin-compatible with the DAC8311
and DAC8411, offering an easy upgrade path from
8-, 10-, and 12-bit resolution to 14- and 16-bit. All
devices are available in a small, 6-pin, SC70 (SOT)
package. This package offers a flexible, pin- and
function-compatible, drop-in solution within the family
over an extended temperature range of –40°C to
+125°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DACx311
SC70 (6)
2.00 mm × 1.25 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
SYNC SCLK DIN
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DAC6311
DAC5311, DAC6311, DAC7311
SBAS442C – AUGUST 2008 – REVISED JULY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison ............................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Timing Requirements ................................................ 7
7.7 Typical Characteristics .............................................. 8
8 Detailed Description ............................................ 22
8.1 Overview ................................................................. 22
8.2 Functional Block Diagram ....................................... 22
8.3 Feature Description................................................. 22
8.4 Device Functional Modes........................................ 24
8.5 Programming........................................................... 25
9 Application and Implementation ........................ 26
9.1 Application Information............................................ 26
9.2 Typical Applications ............................................... 27
10 Power Supply Recommendations ..................... 30
11 Layout................................................................... 31
11.1 Layout Guidelines ................................................. 31
11.2 Layout Example .................................................... 31
12 Device and Documentation Support ................. 32
12.1 Related Links ........................................................ 32
12.2 Community Resources.......................................... 32
12.3 Trademarks ........................................................... 32
12.4 Electrostatic Discharge Caution ............................ 32
12.5 Glossary ................................................................ 32
13 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (May 2013) to Revision C
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Added Device Comparison section and moved existing tables to this new section............................................................... 3
• Moved Operating Temperature parameter from Electrical Characteristics table to Recommended Operating
Conditions table ..................................................................................................................................................................... 4
• Deleted Parameter Definitions section; definitions moved to new Glossary section............................................................ 32
Changes from Revision A (August 2011) to Revision B
Page
• Changed all 1.8 V to 2.0 V throughout data sheet ................................................................................................................. 1
• Deleted the 1.8-V Typical Characteristics section.................................................................................................................. 8
• Changed X-axis for Figure 36............................................................................................................................................... 12
• Changed X-axis for Figure 37............................................................................................................................................... 12
Changes from Original (August, 2008) to Revision A
Page
• Changed specifications and test conditions for input low voltage parameter......................................................................... 6
• Changed specifications and test conditions for input high voltage parameter ....................................................................... 6
2
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