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DPS128X32CV3

Part Number	DPS128X32CV3
Manufacturer	Dense-Pac Microsystems
Description	128kx32 High Speed CMOS SRAM
Published	Dec 14, 2005
Detailed Description	4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ modu...
Datasheet	DPS128X32CV3 PDF File

Overview

4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.
It offers 4 Megabits of SRAM in a package envelope of 1.
090 x 1.
090 x 0.
252 inches.
The DPS128X32CV3/DPS128X32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventio...

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