D-die. M393A1G40DB1 Datasheet

M393A1G40DB1 Datasheet PDF

Part M393A1G40DB1
Description 288pin Registered DIMM based on 4Gb D-die
Feature Rev. 1.8, Aug. 2016 M393A5143DB0 M393A1G40DB0 M393A1G40DB1 M393A1G43DB0 M393A1G43DB1 M393A2G40DB0 M3.
Manufacture Samsung
Datasheet
Download M393A1G40DB1 Datasheet





M393A1G40DB1
Rev. 1.8, Aug. 2016
M393A5143DB0
M393A1G40DB0
M393A1G40DB1
M393A1G43DB0
M393A1G43DB1
M393A2G40DB0
M393A2G40DB1
288pin Registered DIMM
based on 4Gb D-die
78FBGA with Lead-Free & Halogen-Free
(RoHS compliant)
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
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may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
(c) 2016 Samsung Electronics Co., Ltd. All rights reserved.
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M393A1G40DB1
Registered DIMM
datasheet
Rev. 1.8
DDR4 SDRAM
Revision History
Revision No.
1.0
1.1
1.2
1.3
1.4
1.6
1.7
1.71
1.8
History
- First SPEC. Release
- Addition of IDD & IPP value of x8 Product
- Correction of IPP value of x4 Product
- Change of [Table6] Allowed time before ringback(tDVAC) for CK_t -
CK_c on page 17
- Addition of Slew Rate Definition for Single-ended Input Signals ( CMD
/ADD ) on page 19
- Change of [Table 21] Silicon pad I/O Capacitance on page 30
- Change of Speed Bins and CL, tRCD, tRP, tRC and tRAS for corre
sponding bin on page 31~34
- Change of [Table 26] Timing Parameters by Speed Grade on page
35~40
- Change of Registering Clock Driver Specification on page 9
- Change of Part Number (Speed bin "RC")
- Addition of VDDSPD tolerance
- Change of IDD value on page 27~28
- Change of 8.1 Timing & Capacitance values (tACT) on page 9
- Change of Physical Dimensions (Module Thickness) on page 41~43
- Addition of Module line up (M393A5143DB0)
- Correction of typo
- Change of Physical Dimensions (PCB hole) on page 43~46
Draft Date
Mar. 2014
May. 2014
Oct. 2014
Jan. 2015
Mar. 2015
6th Jan. 2016
23th May. 2016
16th Jun. 2016
25th Aug. 2016
Remark
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Editor
S.H.Kim
S.H.Kim
J.Y.Lee
J.Y.Lee
J.Y.Lee
J.Y.Lee
J.Y.Lee
J.Y.Lee
J.Y.Lee
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