Process Geometry
Description
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P0099F
P0099F Process Geometry
Features
Low Noise: 2.0 nV/√Hz Typical Typical Input Capacitance: 18pF Typical Breakdown Voltage: 60V High Input Impedance Small Die: 492um X 492um X 203um Bond Pads: 90um X 90um Substrate Connected to Gate Au Back-Side Finish
Applications
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