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QFN-24

Part Number	QFN-24
Manufacturer	TOREX
Title	Packaging Information / Reference Pattern Layout Dimensions
Description	Packaging Information / Reference Pattern Layout Dimensions ●QFN-24 ■Packaging Information 1 PIN I...
Features	Soldering: Lead (Pb) free Board Dimensions: 40 x 40 mm (1600mm2) Board Structure: 4 Copper Layers Each layer is 50% co...
Published	Mar 13, 2015
Datasheet	QFN-24 PDF File

Features

Soldering: Lead (Pb) free Board Dimensions: 40 x 40 mm (1600mm2) Board Structure: 4 Copper Layers Each layer is 50% connected to the package heat-sink. Material: Glass Epoxy (FR-4) Thickness: 1.0 mm Through-hole: 4 x 0.4 Diameter 40.0 2.5 28...

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