• Very low profile - typical height of 0.95 mm
• Ideal for automated placement
• Oxide planar chip junction
• Low forward voltage drop, low leakage current
• ESD capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Not recommended for PCB bottom side wave mounting
• AEC-Q101 qu...
SE30PAB PDF File
