• Low forward voltage drop
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm Package: eSGP (SOD‐323F) Applications For use in fast swiching in RF module, lighting, cell phone, portable devices, power supplie and ot...
SGP0230SD PDF File
