DatasheetsPDF.com

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750,...

Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)