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Management LSI. BD7185AGWL Datasheet

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Management LSI. BD7185AGWL Datasheet






BD7185AGWL LSI. Datasheet pdf. Equivalent




BD7185AGWL LSI. Datasheet pdf. Equivalent





Part

BD7185AGWL

Description

Power Management LSI



Feature


Datasheet Power Management LSI for Mobi le Phone BD7185AGWL General Descriptio n The BD7185AGWL is an integrated Power Management LSI available in a small 80 -pins 0.4mm-pitch 3.8mm-by3.8mm Wafer-l evel CSP package, which is designed to meet demands for space-constrained Smar t phones. The device provides 5-Buck Co nverters. The device also includes 12 g eneral-purpose LDO.
Manufacture

ROHM

Datasheet
Download BD7185AGWL Datasheet


ROHM BD7185AGWL

BD7185AGWL; s providing a wide range of voltage and current capabilities. All Buck Converte rs and LDOs are fully controllable by t he I2C interface. The BD7185AGWL is ver y easy to use in any mobile platforms. Features  5-channel high-efficiency Buck Converters (16-step adjustable VO by I2C)  12-channel CMOS-type LDO (1 6-step adjustable VO by I2C)  LDO an d Buck Converter power O.


ROHM BD7185AGWL

N/OFF control by I2C interface or extern al pin.  Power ON/OFF sequence.  32.768kHz OSC and output buffer.  4- to-1 analog switch.  TCXO buffer. SIM card I/F  I2C compatible Inter face.  I2C device address changeable by ADRS pin. (Devi .


ROHM BD7185AGWL

.

Part

BD7185AGWL

Description

Power Management LSI



Feature


Datasheet Power Management LSI for Mobi le Phone BD7185AGWL General Descriptio n The BD7185AGWL is an integrated Power Management LSI available in a small 80 -pins 0.4mm-pitch 3.8mm-by3.8mm Wafer-l evel CSP package, which is designed to meet demands for space-constrained Smar t phones. The device provides 5-Buck Co nverters. The device also includes 12 g eneral-purpose LDO.
Manufacture

ROHM

Datasheet
Download BD7185AGWL Datasheet




 BD7185AGWL
Datasheet
Power Management LSI
for Mobile Phone
BD7185AGWL
General Description
The BD7185AGWL is an integrated Power Management
LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by-
3.8mm Wafer-level CSP package, which is designed to
meet demands for space-constrained Smart phones.
The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs
providing a wide range of voltage and current
capabilities.
All Buck Converters and LDOs are fully controllable by
the I2C interface. The BD7185AGWL is very easy to
use in any mobile platforms.
Features
5-channel high-efficiency Buck Converters
(16-step adjustable VO by I2C)
12-channel CMOS-type LDO
(16-step adjustable VO by I2C)
LDO and Buck Converter power ON/OFF control by
I2C interface or external pin.
Power ON/OFF sequence.
32.768kHz OSC and output buffer.
4-to-1 analog switch.
TCXO buffer.
SIM card I/F
I2C compatible Interface.
I2C device address changeable by ADRS pin.
(Device address is “1001011”,”1001100”)
Small and thin CSP package
(3.8mm X 3.8mm height 0.57mm max)
Applications
Smart Phones
Tablets
Mobile Router
Data Transmitter
Key Specifications
Input Voltage Range:
Output Voltage Range:
Switching Frequency:
OFF Current:
Operating Temperature Range:
2.6V to 5.5V
1.0V to 3.4V
2.0MHz(Typ)
0.3μA (Typ)
-35to +85
Package
UCSP50L3C
W(Typ) x D(Typ) x H(Max)
3.80mm x 3.80mm x 0.57mm
Product structureSilicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
This product is not designed protection against radioactive rays
1/75
TSZ02201-0Q4Q0AB00010-1-2
8.Apr.2014 Rev.001




 BD7185AGWL
BD7185AGWL
Datasheet
Absolute Maximum RatingsTa=25C
Parameter
Symbol
Rating
Unit
Maximum Supply Voltage 1
(VBATREF,VBAT, VIN1)
VBATMAX
7.0
V
Maximum Supply Voltage 2
(PBAT1,2,3,4,5)
VPBATMAX
7.0
V
Maximum Supply Voltage 3
(VIN2 )
VIN2MAX
4.2
V
Maximum Input Voltage 1
(OUT1, OUT2, OUT3, OUT4, OUT5,
OUT6,
OUT7, OUT8, OUT9, OUT10,
LX1, LX2, LX3, LX4, LX5,
PSET, ADRS, EN_O7, PWRON,
VINMAX1
7.0
V
PWRHOLD, POR, TCXO_IN,
OSC_IN, DVDD(Note1)
OSC_OUT, SIMRSTIN, SIMCLKIN,
SIMIODBB, SIMIO)
Maximum Input Voltage 2
(SDA, SCL)
VINMAX2
DVDD + 0.3
V
Maximum Input Voltage 3
(OUT11,12, REFC)
Power Dissipation
VINMAX3
Pd
VIN2MAX+ 0.3
1.38(Note 2)
V
W
Operating Temperature Range
Topr
-35 +85
C
Storage Temperature Range
Tstg
-55 +125
C
(Note 1) The DVDD Voltage must be under the Battery voltage VBAT, PBAT anytimes.
(Note 2) This is an allowable loss of the ROHM evaluation board (54mm×62mm). .When a substrate is implemented, the allowable loss varies from the size and material
of the substrate. Derate 1% per °C for temperatures higher than 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between
pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute
maximum ratings.
Recommended Operating Conditions (Ta=25C)
Parameter
Symbol
Range
Unit
VBAT Voltage
VBAT
2.70 5.50 (Note3)
V
PBAT Voltage
VPBAT
2.70 5.50 (Note3)
V
VIN1 Voltage
VIN1
2.70 5.50 (Note4)
V
VIN2 Voltage
VIN2
1.40 1.80 (Note5)
V
(Note 3) Whenever VBAT, PBAT, VIN1, or VIN2 falls below the LDO or SWREG output voltage, or below certain levels, LDO and SWREG output is not guaranteed to
meet the published specifications. It is necessary to supply the same voltage to VBAT and PBAT.
(Note 4) It is recommended to connect SWREG5 output to VIN1 to maximize efficiency.
(Note 5) It is recommended to connect SWREG4 output to VIN2 to maximize efficiency.
Product structureSilicon monolithic integrated circuit
.www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
This product is not designed protection against radioactive rays
2/75
TSZ02201-0Q4Q0AB00010-1-2
8.Apr.2014 Rev.001




 BD7185AGWL
BD7185AGWL
Datasheet
Block Diagram
1uF 1uF 1uF 1uF
I2C Address
1001011 (ADRS=L)
1001100 (ADRS=H)
SWREG5
Built in Bypass Mode
Default=On
Detect Voltage=3.35V
(Refer to page61)
I2C Master
VDD
DATA
CLK
Digital Power
OUT1
connect to DVDD
OUT1
SDA
SCL
ADRS
PSET
PWRON
PWRHOLD
POR
10uF
PBAT1
10uF
2.2uH
LX1
PGND1
FB1
10uF
PBAT2
10uF
2.2uH LX2
PGND2
FB2
10uF
PBAT3
10uF
2.2uH LX3
PGND3
FB3
10uF
PBAT4
10uF
2.2uH LX4
PGND4
FB4
PBAT5
10uF
10uF
2.2uH
LX5
PGND5
FB5
connect to
OUT7
TCXO
0.1uF
ASWIN1
ASWIN2
ASWIN3
ASWIN4
VDDTXCO
TCXO_IN
GNDTCXO
connect to
OUT1
0.1uF
VDDOSC
OSC_IN
OSC_OUT
GNDOSC
SIMRSTIN
SIMCLKIN
SIMIODBB
VBATREF
REFC
0.1uF
I2C IF
POWER
SEQUENCER
SWREG1
1.20V
1A
SWREG2
1.80V
500mA
SWREG3
1.20V
500mA
SWREG4
1.40V
500mA
SWREG5
3.20V
1.4A
5pF
REF
TCXO
Buffer
32.768kHz
OSC
SIM CARD
I/F
Figure 1. Block Diagram
(Note1) Recommend Parts
1. Coil : SWREG2, SWREG3, SWREG4 DFE201612R-H-2R2N ( TOKO )
SWREG1, SWREG5 DFE252012R-H-2R2N ( TOKO)
2. X’tal : FC135 ( EPSON TOYOCOM )
CM7V-T1A ( MICRO CRYSTAL SWITZERLAND )
1uF
LDO1
2.60V or 1.80V
300mA
LDO2
3.30V
50mA
LDO3
1.80V
50mA
LDO4
2.80V
300mA
LDO5
1.20V
150mA
LDO6
2.80V
150mA
LDO7
2.80V
50mA
LDO8
2.50V
150mA
LDO9
2.80V
150mA
LDO10
2.80V
150mA
LDO11
1.20V
150mA
LDO12
1.20V
150mA
OUT1 for I/O
1uF
LDO1 Initial
Output Voltage
1.8V (PSET=L)
2.6V (PSET=H)
OUT2 for USB
1uF
OUT3 for SIM I/F
1uF
OUT4
1uF
OUT5
for PLL
1uF
OUT6
1uF
OUT7 for TCXO
1uF
EN_O7
OUT8 for 2.5V R/F
1uF
OUT9 for LNA
1uF
OUT10 for HKADC
1uF
OUT11 for RX PLL
2.2uF
OUT12 for TX PLL
2.2uF
ASWOUT
TCXO_OUT TCXO_OUT wakes up
530usec from EN_07=H
C32KOUT
SIMRSTOUT
SIMCLKOUT
SIMIO
80 balls
corner
balls
Product structureSilicon monolithic integrated circuit
.www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
This product is not designed protection against radioactive rays
3/75
TSZ02201-0Q4Q0AB00010-1-2
8.Apr.2014 Rev.001



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