Load Switch. APL3222 Datasheet

APL3222 Switch. Datasheet pdf. Equivalent

Part APL3222
Description Slew-Rate-Controlled Load Switch
Feature APL3222 3.5A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Current Blocking Features.
Manufacture ANPEC
Datasheet
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APL3222 3.5A-Capable, Slew-Rate-Controlled Load Switch with APL3222 Datasheet
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APL3222
APL3222
3.5A-Capable, Slew-Rate-Controlled Load Switch with True Reverse
Current Blocking
Features
General Description
Input Voltage Operating Range:1.5V to 5.5V
Typical RDS(ON)
21m
at
V
IN
=5.5V
23mat VIN =4.5V
41mat VIN =1.8V
90m
at
V
IN
=1.5V
Slew Rate/Inrush Control with t = 1.8ms(Typ)
R
3.5A Maximum Continuous Current Capability
Low Off Switch Current <1µA
True Reverse Current Blocking(TRCB)
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Require-
ments
ESD Protected
Human Body Model >8kV
Charged Device Model >1.5kV
IEC 61000-4-2 Air Discharge >15kV
IEC 61000-4-2 Contact Discharge >8kV
Tiny small WLCSP1.2x0.8-6 and VTDFN1.6x1.2-4
Package
Lead Free and Green Devices Available (RoHS
Compliant)
Pin Configuration
The APL3222 advanced load management switch tar-
gets applications requiring a highly integrated solution. It
disconnects loads powered from the DC power rail (<6V)
with stringent off-state current targets and high load ca-
pacitances (up to 100µF). The APL3222 consists of slew-
rate controlled low-impedance MOSFET switch (23m
typical) and integrated analog features. The slew-rate
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on power rails.
The APL3222 has a True Reverse Current Blocking
(TRCB) function that obstructs unwanted reverse current
from VOUT to VIN during both ON and OFF states.
The exceptionally low off-state current drain (<1µA
maximum) facilitates compliance with standby power
requirements. The input voltage range operates from
1.5V to 5.5V to support a wide range of applications in
DC
consumer, optical, medical, storage, portable, and
industrial device power management. Switch control is
managed by a logic input (active HIGH) capable of inter-
facing directly with low-voltage control signal / General-
Purpose Input / Output (GPIO) without an external pull-
down resistor.
The device is packaged in advanced, fully green
compliant, 1.2mm x 0.8mm, Wafer-Level Chip-Scale Pack-
age (WLCSP) with backside lamination.
Top View
VOUT
(A1)
VIN
(A2)
VOUT
(B1)
VIN
(B2)
VIN 1
GND 2
4 VOUT
3 ON
VTDFN-1.6x1.2
(Top View)
Applications
Smart Phones
Tablets PCs
Portable Devices
GND
(C1)
ON
(C2)
WLCSP1.2x0.8-6
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
Rev. A.3 - Dec., 2015
1
www.anpec.com.tw



APL3222
APL3222
Simplified Application Circuit
VIN
1.5~5.5V
VIN VOUT
CIN 1µF~22µF
APL3222
VOUT
COUT
0.1µF~100µF
On
Off
ON
GND
Ordering and Marking Information
APL3222
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
HA : WLCSP1.2x0.8-6 QF : VTDFN1.6x1.2-4
Operating Junction Temperature
I : - 40 to 85 C
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL3222 HA:
2X
X - Date Code
APL3222 QF:
L2
X
X - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines Greento mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN VIN to GND Voltage
-2 ~ 7
V
VOUT
VOUT to GND Voltage
-2 ~ 7
V
VON ON to GND Voltage
-2 ~ 7
V
ISW
TJ
TSTG
TSDR
Maximum Continuous Switch Current
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature (10 Seconds)
0 ~ 3.5
-40 ~ 150
-65 ~ 150
260
A
oC
oC
oC
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Copyright © ANPEC Electronics Corp.
Rev. A.3 - Dec., 2015
2
www.anpec.com.tw





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