Low-Voltage Microcontroller. CY7C60223 Datasheet

CY7C60223 Microcontroller. Datasheet pdf. Equivalent

CY7C60223 Datasheet
Recommendation CY7C60223 Datasheet
Part CY7C60223
Description Low-Voltage Microcontroller
Feature CY7C60223; CY7C601xx/CY7C602xx enCoRe™ II Low-Voltage Microcontroller 1. Features ■ enCoRe II low-voltage (en.
Manufacture Cypress Semiconductor
Datasheet
Download CY7C60223 Datasheet




Cypress Semiconductor CY7C60223
COMPANY
CONFIDENTIAL
CY7C60223
enCoRe™ II Low Voltage Microcontroller
Die
General Physical Specification
For product parameters and availability, refer to the CY7C60223 product datasheets available on the Cypress Semiconductor web
site (http://www.cypress.com/).
Table 1. CY7C60223 Die Physical Specification
Marketing Part Number CY7C60223
Die Part Number 7C60223
Substrate Connection Req.: Ground
Wafer Diameter [mm]: 203.2
Die Technology: 0.35 µm CMOS
Metal I: AlCu 0.6 µm
Metal II: AlCu 0.8 µm
Metal III: NA
Die Passivation: 0.6 µm SiO2/0.6 µm Si3N4
Die Size [µm]: 1727 µm × 2187 µm
Step Size [µm]: 1792.98 µm × 2272.998 µm
Scribe Size [µm]: 65 × 86
Pad Count: 23
Pad Size [µm]: 70 µm × 70 µm
Product Thickness Guide
Table 2. Thickness Guide for CY7C60223
Code
X14
Die (14 Mils)
Description
3XWC Wafer (29 Mils)
Min
342.5
710
Nom
355
725
Max
367.5
740
Unit
µm
µm
Bond Pads
Figure 1. 7C60223 Bond Pad Locations [1]
23
1 Cypress Logo
2
3
4
Y
22
21
20
19
18
17
16
15
X
5
6
7
8
9
10
14
13
12
11
Note
1. The bond pad diagram gives the approximate location of the pads. The bond pad co-ordinates table gives the accurate location of the pads on the following page.
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-75790 Rev. *D
• San Jose, CA 95134-1709 • 408-943-2600
Revised February 4, 2015



Cypress Semiconductor CY7C60223
COMPANY
CONFIDENTIAL
CY7C60223
Table 3. Bond Pad Coordinates and Signal Description
Pad Index
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Pad Name
P0.7
P0.6/TIO1
P0.5/TIO0
P0.4/INT2
P0.3/INT1
P0.2/INT0
P0.1/CLKOUT
P0.0/CLKIN
P2.1
P2.0
VSS
P1.0
P1.1
VDD
P1.2
Pad Co-ordinates
X (microns) Y (microns)
Signal Description
–742.730
911.99 GPIO Port 0 bit 7 – Configured individually
–755.060
792.2
GPIO Port 0 bit 6 – Configured individually
Alternate function Timer capture inputs or Timer output TIO1
–755.060
699.3
GPIO Port 0 bit 5 – Configured individually
Alternate function Timer capture inputs or Timer output TIO0
–755.060
606.4
GPIO Port 0 bit 4 – Configured individually
Optional rising edge interrupt INT2.
–755.060
–430.080
GPIO Port 0 bit 3 – Configured individually
Optional rising edge interrupt INT1.
–755.060
–522.980
GPIO Port 0 bit 2 – Configured individually
Optional rising edge interrupt INT0.
–755.060
–618.830
GPIO Port 0 bit 1 – Configured individually
Oscillator output when configured as Clock Out.
–755.060
–714.020
GPIO port 0 bit 0 – Configured individually
Oscillator input when configured as Clock In.
–755.060
–393.580
–810.220
GPIO port 2 – configured as a group (byte)
–977.930
537.5
–964.700 Ground
736.11
GPIO port 1 bit 0/ISSP-SCLK. If this pin is used as a general-purpose
–936.680 output it draws current. It is, therefore, configured as an input to
reduce current draw.
736.11
GPIO port 1 bit 1/ISSP-SDATA
–625.130 If this pin is used as a general-purpose output it draws current. It is,
therefore, configured as an input to reduce current draw.
736.11
–260.670 Power
736.11
53.8 GPIO port 1 bit 2
16
P1.3/SSEL
723.51
336.78
GPIO port 1 bit 3 – Configured individually
Alternate function is SSEL signal of the SPI bus.
17
P3.0
723.51
438.69
GPIO port 3 – Configured as a group (byte)
18
P3.1
723.51
532.88
19
P1.4/SCLK
723.51
635.31
GPIO port 1 bit 4 – Configured individually
Alternate function is SCLK signal of the SPI bus.
20
P1.5/SMOSI
723.51
728.22
GPIO port 1 bit 5 – Configured individually
Alternate function is SMOSI signal of the SPI bus.
21
P1.6/SMISO
723.51
839.29
GPIO port 1 bit 6 – Configured individually
Alternate function is SMISO signal of the SPI bus.
22
P1.7
696.63
1008.48
GPIO port 1 bit 7 – Configured individually
TTL voltage threshold.
23
NC
–795.400
1023.27 No Connect
Document Number: 001-75790 Rev. *D
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Cypress Semiconductor CY7C60223
COMPANY
CONFIDENTIAL
Die Ordering Information
Ordering Code
CY7C60223-3X14C
CY7C60223-3XWC
CG7593AS
Die Type
Die (14 Mils) in waffle pack
Die (29 Mils) in wafer form
Die (14 Mils) in waffle pack
Ordering Code Definitions
CY 7 C 60223 - XXXX C
CY7C60223
Operating Range
Commercial
Commercial
Commercial
Temperature Range:
C = Commercial
Die Type: XXXX = 3X14 or 3XW
3X14 = Die (14 Mils) in waffle pack; 3XW = Die (29 Mils) in wafer form
Part Identifier
Technology Code: C = CMOS
Marketing Code: 7 = Wireless USB
Company ID: CY = Cypress
CG 7593AS
Part Identifier
CG = Customer Generic
Document Conventions
Units of Measure
Symbol
m micrometer
Unit of Measure
Document Number: 001-75790 Rev. *D
Page 3 of 5







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