Signal Conditioner. ZSSC3131 Datasheet

ZSSC3131 Conditioner. Datasheet pdf. Equivalent

ZSSC3131 Datasheet
Recommendation ZSSC3131 Datasheet
Part ZSSC3131
Description Sensor Signal Conditioner
Feature ZSSC3131; Sensor Signal Conditioner for CostOptimized Switch Applications ZSSC3131 Datasheet Brief Descripti.
Manufacture IDT
Datasheet
Download ZSSC3131 Datasheet





IDT ZSSC3131
Sensor Signal Conditioner for Cost-
Optimized Switch Applications
ZSSC3131
Datasheet
Brief Description
The ZSSC3131 is a member of the ZSSC313x
product family of CMOS integrated circuits designed
for automotive/ industrial sensor applications. All
family members are well suited for highly-accurate
amplification and sensor-specific correction of
resistive bridge sensor signals. An internal 16-bit
RISC microcontroller running a correction algorithm
compensates sensor offset, sensitivity, temperature
drift, and non-linearity of the connected sensor
element. The required calibration coefficients are
stored by the one-pass calibration procedure in an
on-chip EEPROM.
The ZSSC3131 is optimized for simple switch and
cost-sensitive sensor applications. The integrated
adjustable digital filter enables building fast-switch-
ing real-time applications as well as stabilized
applications for switching input signals that are
unstable or disrupted.
Features
Adjustable to nearly all resistive bridge sensor
types: maximum analog gain of 105; maximum
overall gain of 420
Sample rate up to 200 Hz
ADC resolution 13/14 bit
Internal temperature compensation
Integrated adjustable digital filter
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
Output options: ratiometric analog voltage output
(5 - 95% maximum, 12.4 bit resolution) or
ZACwireTM (digital One-Wire Interface (OWI))
Sensor biasing by voltage
High voltage protection up to 33 V
Supply current: Max. 5.5mA
Reverse polarity and short circuit protection
Wide operation temperature range:
-40 to +150°C
Traceability by user-defined EEPROM entries
* Note: I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
Benefits
Family approach offers the best fitting IC selec-
tion to build cost-optimized applications
No external trimming components required
Low number of external components needed
PC-controlled configuration and One-Pass/ end-
of-line calibration via I²C™* or ZACwire™
interface: Simple, cost-efficient, quick, and pre-
cise
High accuracy (0.25% FSO** @ -25 to +85°C;
0.5% FSO @ -40 to +125°C)
Optimized for automotive/industrial environments
due to robust protection circuitries, excellent
electromagnetic compatibility, and AEC-Q100
qualification
Available Support
Evaluation Kits
Application Notes
Mass Calibration System
Physical Characteristics
Supply voltage 4.5 to 5.5 V
Operation temperature: -40°C to +125°C
(-40°C to +150°C extended temperature range
depending on product version)
Available in RoHS-compliant JEDEC-SSOP14
package or delivery as die
ZSSC3131 Minimum Application Requirements
Sensor
Module
VCC
ZSSC3131
OUT
GND
© 2016 Integrated Device Technology, Inc.
1
January 25, 2016



IDT ZSSC3131
Sensor Signal Conditioner for Cost-
Optimized Switch Applications
ZSSC3131
Datasheet
ZSSC3131 Switch Application Example
Sensor Bridge
C3
47nF
C4 C5
8 VSSE
9 AOUT
10 VBN
11 VBR_B
12 VBP
13 VBR_T
14 N.C.
Out
VDDE 7
VDD 6
n.c. 5
SCL 4
SDA 3
VSSA 2
C2
100nF
GND
VSUPP
+4.5V to +5.5V
VSUPP
R1
2kΩ 12 VSUPP
Out 13 GPIO
14 GND
VDDA 1
C1
100nF
Ordering Information (See data sheet section 8 for complete delivery options.)
Product Sales Code
ZSSC3131BE1
ZSSC3131BA1
ZSSC3131BE2
ZSSC3131BA2
ZSSC313xKITV1.1
ZSSC313x Mass
Calibration System V1.1
Description
Package
ZSSC3131 die – tested; temperature range -40 to +150°C
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
ZSSC3131 die – tested; temperature range -40 to +125°C
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
ZSSC3131 SSOP14 – temperature range -40 to +150°C
Tube: add “T” to sales code
Tape & Reel: add “R”
ZSSC3131 SSOP14 – temperature range -40 to +125°C
Tube: add “T” to sales code
Tape & Reel: add “R”
ZSSC313x Evaluation Kit, revision 1.1, including Evaluation Board, Kit
ZSSC3131 IC samples, USB cable (software can be downloaded from
the product page www.IDT.com/ZSSC3131)
Modular Mass Calibration System (MSC) for ZSSC313x including
MCS boards, cable, connectors (software can be downloaded from
the product page www.IDT.com/ZSSC3131)
Kit
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
2
January 25, 2016



IDT ZSSC3131
ZSSC3131 Datasheet
Contents
1 Electrical Characteristics ...............................................................................................................................5
1.1. Absolute Maximum Ratings....................................................................................................................5
1.2. Operating Conditions ..............................................................................................................................5
1.3. Electrical Parameters .............................................................................................................................6
1.3.1. Supply Current and System Operation Conditions ..........................................................................6
1.3.2. Analog Front-End (AFE) Characteristics .........................................................................................6
1.3.3. Temperature Measurement .............................................................................................................6
1.3.4. A/D Conversion ................................................................................................................................6
1.3.5. DAC and Analog Output ..................................................................................................................7
1.3.6. System Response ............................................................................................................................7
1.4. Interface Characteristics and EEPROM .................................................................................................9
1.4.1. I²CTM Interface ..................................................................................................................................9
1.4.2. ZACwire™ One-Wire Interface (OWI) .............................................................................................9
1.4.3. EEPROM..........................................................................................................................................9
2 Circuit Description .......................................................................................................................................10
2.1. Signal Flow ...........................................................................................................................................10
2.2. Application Modes ................................................................................................................................11
2.3. Analog Front-End (AFE) .......................................................................................................................11
2.3.1. Programmable Gain Amplifier (PGA).............................................................................................11
2.3.2. Offset Compensation .....................................................................................................................12
2.3.3. Measurement Cycle .......................................................................................................................12
2.3.4. Analog-to-Digital Converter............................................................................................................13
2.4. Temperature Measurement ..................................................................................................................14
2.5. System Control and Conditioning Calculation ......................................................................................14
2.5.1. General Working Modes ................................................................................................................14
2.5.2. Startup Phase ...............................................................................................................................14
2.5.3. Conditioning Calculation ................................................................................................................15
2.6. Analog or Digital Output .......................................................................................................................15
2.7. Serial Digital Interface ..........................................................................................................................16
2.8. Failsafe Features ..................................................................................................................................16
2.9. High Voltage, Reverse Polarity, and Short Circuit Protection ..............................................................16
3 Application Circuit Examples.......................................................................................................................17
4 Pin Configuration and Package...................................................................................................................18
5 ESD Protection ............................................................................................................................................19
6 Quality and Reliability..................................................................................................................................19
7 Customization..............................................................................................................................................19
8 Ordering Information ...................................................................................................................................20
9 Related Documents.....................................................................................................................................21
10 Glossary ......................................................................................................................................................21
11 Document Revision History .........................................................................................................................23
© 2016 Integrated Device Technology, Inc.
3
January 25, 2016





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