Flow-Through SRAM. CY7C1351G Datasheet

CY7C1351G SRAM. Datasheet pdf. Equivalent

CY7C1351G Datasheet
Recommendation CY7C1351G Datasheet
Part CY7C1351G
Description 4-Mbit (128K x 36) Flow-Through SRAM
Feature CY7C1351G; CY7C1351G 4-Mbit (128K × 36) Flow-Through SRAM with NoBL™ Architecture 4-Mbit (128K × 36) Flow-Thro.
Manufacture Cypress Semiconductor
Datasheet
Download CY7C1351G Datasheet




Cypress Semiconductor CY7C1351G
CY7C1351G
4-Mbit (128K × 36) Flow-Through SRAM
with NoBL™ Architecture
4-Mbit (128K × 36) Flow-Through SRAM with NoBL™ Architecture
Features
Can support up to 133-MHz bus operations with zero wait
states
Data is transferred on every clock
Pin compatible and functionally equivalent to ZBT™ devices
Internally self-timed output buffer control to eliminate the need
to use OE
Registered inputs for flow-through operation
Byte write capability
128 K × 36 common I/O architecture
2.5 V/3.3 V I/O power supply (VDDQ)
Fast clock-to-output times
6.5 ns (for 133-MHz device)
Clock enable (CEN) pin to suspend operation
Synchronous self-timed writes
Asynchronous output enable
Available in Pb-free 100-pin TQFP package
Burst capability – linear or interleaved burst order
Low standby power
Functional Description
The CY7C1351G is a 3.3 V, 128K × 36 synchronous flow-through
burst SRAM designed specifically to support unlimited true
back-to-back read/write operations without the insertion of wait
states. The CY7C1351G is equipped with the advanced No Bus
Latency™ (NoBL™) logic required to enable consecutive
Read/Write operations with data being transferred on every clock
cycle. This feature dramatically improves the throughput of data
through the SRAM, especially in systems that require frequent
write-read transitions.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock input is qualified by the
clock enable (CEN) signal, which when deasserted suspends
operation and extends the previous clock cycle. Maximum
access delay from the clock rise is 6.5 ns (133-MHz device).
Write operations are controlled by the four byte write select
(BW[A:D]) and a write enable (WE) input. All writes are conducted
with on-chip synchronous self-timed write circuitry.
Three synchronous chip enables (CE1, CE2, CE3) and an
asynchronous output enable (OE) provide for easy bank
selection and output tristate control. In order to avoid bus
contention, the output drivers are synchronously tristated during
the data portion of a write sequence.
For a complete list of related documentation, click here.
Selection Guide
Maximum access time
Maximum operating current
Maximum CMOS standby current
Description
133 MHz
6.5
225
40
100 MHz
8.0
205
40
Unit
ns
mA
mA
Errata: For information on silicon errata, see "Errata" on page 19. Details include trigger conditions, devices affected, and proposed workaround.
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 38-05513 Rev. *Q
• San Jose, CA 95134-1709 • 408-943-2600
Revised November 3, 2016



Cypress Semiconductor CY7C1351G
CY7C1351G
Logic Block Diagram
A0, A1, A
MODE
CLK C
CEN
CE
ADDRESS
REGISTER
A1
A0
D1
D0
ADV/LD
C
WRITE ADDRESS
REGISTER
Q1
Q0
A1'
A0'
BURST
LOGIC
ADV/LD
BWA
BWB
BWC
BWD
WE
OE
CE1
CE2
CE3
ZZ
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
READ LOGIC
SLEEP
Control
WRITE
DRIVERS
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
INPUT E
REGISTER
O
U
T
DP
AU
TT
A
B
SU
TF
EF
EE
RR
IS
NE
G
DQs
DQPA
DQPB
DQPC
DQPD
Document Number: 38-05513 Rev. *Q
Page 2 of 22



Cypress Semiconductor CY7C1351G
CY7C1351G
Contents
Pin Configurations ........................................................... 4
Pin Definitions .................................................................. 5
Functional Overview ........................................................ 7
Single Read Accesses ................................................ 7
Burst Read Accesses .................................................. 7
Single Write Accesses ................................................. 7
Burst Write Accesses .................................................. 7
Sleep Mode ................................................................. 7
Linear Burst Address Table ......................................... 8
Interleaved Burst Address Table ................................. 8
ZZ Mode Electrical Characteristics .............................. 8
Truth Table ........................................................................ 9
Partial Truth Table for Read/Write .................................. 9
Maximum Ratings ........................................................... 10
Operating Range ............................................................. 10
Electrical Characteristics ............................................... 10
Capacitance .................................................................... 11
Thermal Resistance ........................................................ 11
AC Test Loads and Waveforms ..................................... 12
Switching Characteristics .............................................. 13
Switching Waveforms .................................................... 14
Ordering Information ...................................................... 16
Ordering Code Definitions ......................................... 16
Package Diagrams .......................................................... 17
Acronyms ........................................................................ 18
Document Conventions ................................................. 18
Units of Measure ....................................................... 18
Errata ............................................................................... 19
Part Numbers Affected .............................................. 19
Product Status ........................................................... 19
Ram9 NoBL ZZ Pin Issues Errata Summary ............. 19
Document History Page ................................................. 20
Sales, Solutions, and Legal Information ...................... 22
Worldwide Sales and Design Support ....................... 22
Products .................................................................... 22
PSoC®Solutions ....................................................... 22
Cypress Developer Community ................................. 22
Technical Support ..................................................... 22
Document Number: 38-05513 Rev. *Q
Page 3 of 22







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