MMSZ5250B zener diode Datasheet

MMSZ5250B Datasheet, PDF, Equivalent


Part Number

MMSZ5250B

Description

Surface mount zener diode

Manufacture

Bruckewell

Total Page 4 Pages
Datasheet
Download MMSZ5250B Datasheet


MMSZ5250B
MMSZ5221B-MMSZ5260B
Surface mount zener diode
Features
Planar die construction.
500mW power dissipation.
General purpose, medium current.
Ideally suited for automated assembly processes.
RoHS compliant package
Applications
Zener diode.
Ultra-small surface mount package.
Packing & Order Information
3,000/Reel
Graphic symbol
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
MAXIMUM RATING @ Ta=25°C unless otherwise specified
Symbol
Parameter
Value
VF Forward Voltage @ IF=10mA
0.9
PD
JA
Power Dissipation
Thermal resistance,junction to ambient air
500
350
TJ Junction Temperature
150
Tstg Storage Temperature Range
-65 to +150
Notes:
1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.
2. Tested with pulses, Tp ≤1.0ms.
Unit
V
mW
°C/W
°C
°C
Publication Order Number: [MMSZ5221B-MMSZ5260B]
© Bruckewell Technology Corporation Rev. A -2014

MMSZ5250B
MMSZ5221B-MMSZ5260B
Surface mount zener diode
ELECTRICAL CHARACTERISTICS @ Ta=25°C unless otherwise specified
Type
Number
Type
Code
Zener Voltage Range
VZ @ IZT
Min Nom Max
Test
Current
IZT
(mA)
Maximum Zener
Impedance
ZZT@IZT ZZK@IZK=0.25mA
(Ω)
MMSZ5221B C1 2.4 2.28 2.52
20
30
1200
MMSZ5223B C3 2.7 2.57 2.84
20
30
1300
MMSZ5225B C5
3.0 2.85 3.15
20
30
1600
MMSZ5226B G1 3.3 3.14 3.47
20
28
1600
MMSZ5227B G2 3.6 3.42 3.78
20
24
1700
MMSZ5228B G3 3.9 3.71 4.10
20
23
1900
MMSZ5229B G4 4.3 4.09 4.52
20
22
2000
MMSZ5230B G5 4.7 4.47 4.94
20
19
1900
MMSZ5231B E1 5.1 4.85 5.36
20
17
1600
MMSZ5232B E2 5.6 5.32 5.88
20
11
1600
MMSZ5233B E3 6.0 5.70 6.30
20
7
1600
MMSZ5234B E4 6.2 5.89 6.51
20
7
1000
MMSZ5235B E5 6.8 6.46 7.14
20
5
750
MMSZ5236B F1
7.5 7.13 7.88
20
6
500
MMSZ5237B F2
8.2 7.79 8.61
20
8
500
MMSZ5238B F3
8.7 8.27 9.14
20
8
600
MMSZ5239B F4
9.1 8.65 9.56
20
10
600
MMSZ5240B F5
10 9.50 10.50
20
17
600
MMSZ5241B H1
11 10.45 11.55
20
22
600
MMSZ5242B H2
12 11.40 12.60
20
30
600
MMSZ5243B H3
13 12.35 13.65
9.5
13
600
MMSZ5245B H5
15 14.25 15.75
8.5
16
600
MMSZ5246B J1
16 15.20 16.80
7.8
17
600
MMSZ5248B J3
18 17.10 18.90
7.0
21
600
MMSZ5250B J5
20 19.00 21.00
6.2
25
600
MMSZ5251B K1
22 20.90 23.10
5.6
29
600
MMSZ5252B K2
24 22.80 25.20
5.2
33
600
MMSZ5254B K4
27 25.65 28.35
5.0
41
600
MMSZ5255B K5
28 26.60 29.40
4.5
44
600
MMSZ5256B M1
30 28.50 31.5
4.2
49
600
Maximum
Reverse
Leakage Current
IR @VR
(μA) (V)
100 1.0
75 1.0
50 1.0
25 1.0
15 1.0
10 1.0
5.0 1.0
5.0 2.0
5.0 2.0
5.0 3.0
5.0 3.5
5.0 4.0
3.0 5.0
3.0 6.0
3.0 6.5
3.0 6.5
3.0 7.0
3.0 8.0
2.0 8.4
1.0 9.1
0.5 9.9
0.1 11
0.1 12
0.1 14
0.1 15
0.1 17
0.1 18
0.1 21
0.1 21
0.1 23
Publication Order Number: [MMSZ5221B-MMSZ5260B]
© Bruckewell Technology Corporation Rev. A -2014


Features MMSZ5221B-MMSZ5260B Surface mount zener diode Features • Planar die construct ion. • 500mW power dissipation. • G eneral purpose, medium current. • Ide ally suited for automated assembly proc esses. • RoHS compliant package Appli cations • Zener diode. • Ultra-smal l surface mount package. Packing & Orde r Information 3,000/Reel Graphic symbo l MAXIMUM RATINGS AND ELECTRICAL CHARA CTERISTICS MAXIMUM RATING @ Ta=25°C u nless otherwise specified Symbol Para meter Value VF Forward Voltage @ IF=1 0mA 0.9 PD RθJA Power Dissipation T hermal resistance,junction to ambient a ir 500 350 TJ Junction Temperature 1 50 Tstg Storage Temperature Range -65 to +150 Notes: 1. Device mounted on c eramic PCB; 7.6 mm x 9.4 mm x 0.87 mm w ith pad areas 25 mm2. 2. Tested with pu lses, Tp ≤1.0ms. Unit V mW °C/W °C °C Publication Order Number: [MMSZ52 21B-MMSZ5260B] © Bruckewell Technolog y Corporation Rev. A -2014 MMSZ5221B-M MSZ5260B Surface mount zener diode ELECTRICAL CHARACTERISTICS .
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