Attenuator Diodes. HSMP-4810 Datasheet

HSMP-4810 Diodes. Datasheet pdf. Equivalent


Part HSMP-4810
Description Surface Mount RF PIN Low Distortion Attenuator Diodes
Feature HSMP-381x, 481x Surface Mount RF PIN Low Distortion Attenuator Diodes Data Sheet Description/Applic.
Manufacture AVAGO
Datasheet
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HSMP-381x, 481x Surface Mount RF PIN Low Distortion Attenuat HSMP-4810 Datasheet
Recommendation Recommendation Datasheet HSMP-4810 Datasheet




HSMP-4810
HSMP-381x, 481x
Surface Mount RF PIN
Low Distortion Attenuator Diodes
Data Sheet
Description/Applications
The HSMP-381x series is specifically designed for low dis-
tortion attenuator applications. The HSMP-481x products
feature ultra low parasitic inductance in the SOT-23 and
SOT-323 packages. They are specifically designed for use
at frequencies which are much higher than the upper limit
for conventional diodes.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
Features
x Diodes Optimized for:
– Low Distortion Attenuating
– Microwave Frequency Operation
x Surface Mount Packages
– Single and Dual Versions
– Tape and Reel Options Available
x Low Failure in Time (FIT) Rate[1]
x Lead free
Package Lead Code Identification,
SOT-23
(Top View)
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Package Lead Code Identification,
SOT-323
(Top View)
SINGLE
3
SERIES
3
SINGLE
SERIES
12
#0
COMMON
ANODE
3
12
#2
COMMON
CATHODE
3
B
COMMON
ANODE
C
COMMON
CATHODE
12
#3
REVERSE
SERIES
3
12
#4
DUAL
CATHODE
3
E
DUAL CATHODE
F
12
#5
12
4810
481B



HSMP-4810
Absolute Maximum Ratings[1] T = +25°C
C
Symbol Parameter
Unit SOT-23
SOT-323
If
Forward Current (1 μs Pulse)
Amp 1
1
P Peak Inverse Voltage
IV
V
Same as V
Same as V
BR BR
T Junction Temperature
j
°C 150
150
T Storage Temperature
stg
°C
-65 to 150
-65 to 150
Tjc Thermal Resistance [2]
°C/W 500
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications T = +25°C (Each Diode)
C
Conventional Diodes
Part
Number
HSMP-
Package
Marking
Code
3810 E0
3812 E2
3813 E3
3814 E4
3815 E5
381B E0
381C E2
381E E3
381F E4
Test Conditions
Lead
Code
0
2
3
4
5
B
C
E
F
Configuration
Single
Series
Common Anode
Common Cathode
Reverse Series
Single
Series
Common Anode
Common Cathode
Minimum
Breakdown
Voltage VBR
(V)
100
V =V
R BR
Measure
I ≤ 10uA
R
Maximum
Total
Capacitance
CT (pF)
0.35
V = 50V
R
f = 1MHz
Minimum
Resistance
at
IF = 0.01mA,
RH (Ω)
1500
I = 0.01mA
F
f = 100MHz
Maximum
Resistance
at
IF = 20mA,
RL (Ω)
10
I = 20mA
F
f = 100MHz
Maximum
Resistance
at
IF = 100mA,
RT (Ω)
3.0
I = 100mA
F
f = 100MHz
Resistance
at
IF = 1mA,
RM (Ω)
48 to 70
I = 1mA
F
f = 100MHz
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes
Minimum Maximum Series
Typical Maximum Typical
Part Package
Breakdown Series Resistance
Total
Total Total
Number Marking Lead
HSMP-
Code Code Configuration
Voltage
VBR (V)
Resistance
RS (Ω)
IF = 1mA,
RM (Ω)
Capacitance Capacitance Inductance
CT (pF)
CT (pF)
LT (nH)
4810
481B
EB B Dual Cathode
100
EB B Dual Cathode
3
48 - 70
0.35
0.4
1
Test Conditions
V =V
R BR
Measure
IR ≤ 10μA
I = 100mA
F
f=
100MHz
I = 1mA
F
f = 100MHz
V = 50V
R
f = 1MHz
V = 50V
R
f = 1MHz
f=
500MHz
- 3GHz
2







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