K20 Sub-Family. K20P32M50SF0 Datasheet

K20P32M50SF0 Sub-Family. Datasheet pdf. Equivalent

Part K20P32M50SF0
Description K20 Sub-Family
Feature Freescale Semiconductor Data Sheet: Technical Data Document Number: K20P32M50SF0 Rev. 4 5/2012 K20.
Manufacture Freescale Semiconductor
Datasheet
Download K20P32M50SF0 Datasheet




K20P32M50SF0
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K20P32M50SF0
Rev. 4 5/2012
K20 Sub-Family
Supports the following:
MK20DN32VFM5, MK20DX32VFM5,
MK20DN64VFM5, MK20DX64VFM5,
MK20DN128VFM5, MK20DX128VFM5
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 50 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 128 KB program flash.
– Up to 32 KB FlexNVM on FlexMemory devices
– 2 KB FlexRAM on FlexMemory devices
– Up to 16 KB RAM
– Serial programming interface (EzPort)
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– 4-channel DMA controller, supporting up to 41
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
K20P32M50SF0
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
Analog modules
– 16-bit SAR ADC
– Two analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two-channel quadrature decoder/general purpose
timer
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– SPI module
– I2C module
– Two UART modules
– I2S module
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2011–2012 Freescale Semiconductor, Inc.



K20P32M50SF0
Table of Contents
1 Ordering parts...........................................................................3
5.4 Thermal specifications.......................................................21
1.1 Determining valid orderable parts......................................3
5.4.1 Thermal operating requirements...........................21
2 Part identification......................................................................3
5.4.2 Thermal attributes.................................................21
2.1 Description.........................................................................3
6 Peripheral operating requirements and behaviors....................22
2.2 Format...............................................................................3
6.1 Core modules....................................................................22
2.3 Fields.................................................................................3
6.1.1 JTAG electricals....................................................22
2.4 Example............................................................................4
6.2 System modules................................................................25
3 Terminology and guidelines......................................................4
6.3 Clock modules...................................................................25
3.1 Definition: Operating requirement......................................4
6.3.1 MCG specifications...............................................25
3.2 Definition: Operating behavior...........................................5
6.3.2 Oscillator electrical specifications.........................27
3.3 Definition: Attribute............................................................5
6.3.3 32 kHz Oscillator Electrical Characteristics...........29
3.4 Definition: Rating...............................................................6
6.4 Memories and memory interfaces.....................................30
3.5 Result of exceeding a rating..............................................6
6.4.1 Flash electrical specifications................................30
3.6 Relationship between ratings and operating
6.4.2 EzPort Switching Specifications............................34
requirements......................................................................6
6.5 Security and integrity modules..........................................35
3.7 Guidelines for ratings and operating requirements............7
6.6 Analog...............................................................................35
3.8 Definition: Typical value.....................................................7
6.6.1 ADC electrical specifications.................................35
3.9 Typical value conditions....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications.........40
4 Ratings......................................................................................9
6.7 Timers................................................................................43
4.1 Thermal handling ratings...................................................9
6.8 Communication interfaces.................................................43
4.2 Moisture handling ratings..................................................9
6.8.1 USB electrical specifications.................................43
4.3 ESD handling ratings.........................................................9
6.8.2 USB DCD electrical specifications........................43
4.4 Voltage and current operating ratings...............................9
6.8.3 USB VREG electrical specifications......................44
5 General.....................................................................................10
6.8.4 DSPI switching specifications (limited voltage
5.1 AC electrical characteristics..............................................10
range)....................................................................44
5.2 Nonswitching electrical specifications...............................11
6.8.5 DSPI switching specifications (full voltage range).46
5.2.1 Voltage and current operating requirements.........11
6.8.6 I2C switching specifications..................................48
5.2.2 LVD and POR operating requirements.................11
6.8.7 UART switching specifications..............................48
5.2.3 Voltage and current operating behaviors..............12
6.8.8 I2S/SAI Switching Specifications..........................48
5.2.4 Power mode transition operating behaviors..........13
6.9 Human-machine interfaces (HMI)......................................52
5.2.5 Power consumption operating behaviors..............14
6.9.1 TSI electrical specifications...................................52
5.2.6 EMC radiated emissions operating behaviors.......18
7 Dimensions...............................................................................54
5.2.7 Designing with radiated emissions in mind...........19
7.1 Obtaining package dimensions.........................................54
5.2.8 Capacitance attributes..........................................19
8 Pinout........................................................................................54
5.3 Switching specifications.....................................................19
8.1 K20 Signal Multiplexing and Pin Assignments..................54
5.3.1 Device clock specifications...................................19
8.2 K20 Pinouts.......................................................................55
5.3.2 General switching specifications...........................20
9 Revision History........................................................................56
K20 Sub-Family Data Sheet, Rev. 4 5/2012.
2 Freescale Semiconductor, Inc.







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