outline package. SOT1061 Datasheet

SOT1061 package. Datasheet pdf. Equivalent

SOT1061 Datasheet
Recommendation SOT1061 Datasheet
Part SOT1061
Description plastic thermal enhanced ultra thin small outline package
Feature SOT1061; HUSON3 SOT1061 DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 .
Manufacture NXP
Datasheet
Download SOT1061 Datasheet




NXP SOT1061
SOT1061
DFN2020-3: plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2 x 2 x 0.65 mm
8 February 2016
Package information
1. Package summary
Terminal position code
Package type descriptive code
Package type industry code
Package style descriptive code
Package style suffix code
Package body material type
IEC package outline code
JEDEC package outline code
JEITA package outline code
Mounting method type
Issue date
Table 1. Package summary
Symbol
Parameter
D package length
E package width
A seated height
n2 actual quantity of termination
D (double)
DFN2020-3
DFN2020-3
HUSON (thermal enhanced ultra thin small
outline; no leads)
NA (not applicable)
P (plastic)
---
---
---
S (surface mount)
7-10-2008
Min
Typ
Nom
Max
Unit
1.9 -
2 2.1 mm
1.9 -
2 2.1 mm
[tbd] -
0.65 0.65 mm
- - 3-



NXP SOT1061
NXP Semiconductors
2. Package outline
SOT1061
DFN2020-3: plastic thermal enhanced ultra thin
small outline package; no leads; 3 terminals;
body 2 x 2 x 0.65 mm
HUSON3: plastic thermal enhanced ultra thin small outline package; no leads;
3 terminals; body 2 x 2 x 0.65 mm
SOT1061
X
b v AB
D BA
A
E A1
terminal 1
index area
terminal 1
index area
L
1
e
2
detail X
y1 C
C
y
(6×)
e1
Eh
3
Dh
Dimensions
0 1 2 mm
scale
Unit A(1) A1 b D Dh E Eh e e1 L v y y1
max 0.65 0.04 0.35 2.1 1.6 2.1 1.1
0.3 0.45
mm nom
2.0 2.0 1.3
0.1 0.05 0.05
min
0.25 1.9 1.4 1.9 0.9
0.2 0.35
Note
1. Including plating thickness
Outline
References
version
IEC
JEDEC
JEITA
SOT1061
---
Fig. 1. Package outline DFN2020-3 (SOT1061)
European
projection
sot1061_po
Issue date
08-02-04
08-10-07
SOT1061
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved
2/5



NXP SOT1061
NXP Semiconductors
3. Soldering
1.05
2.3 0.6 0.55
SOT1061
DFN2020-3: plastic thermal enhanced ultra thin
small outline package; no leads; 3 terminals;
body 2 x 2 x 0.65 mm
2.1
1.3
0.5 (2×)
0.4 (2×)
0.5 (2×) 0.6 (2×)
0.25
1.1
1.2
0.4
0.5
1.6
solder paste = solder lands
1.7
solder resist
occupied area
Fig. 2. Reflow soldering footprint for DFN2020-3 (SOT1061)
0.25 0.25
Dimensions in mm
sot1061_fr
SOT1061
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved
3/5







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