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SOT1061

NXP

plastic thermal enhanced ultra thin small outline package


Description
HUSON3 SOT1061 DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm 8 February 2016 Package information 1. Package summary Terminal position code Package type descriptive code Package type industry code Package style descriptive code Package style suffix code Package body material type IEC p...



NXP

SOT1061

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