LCD Controller-Driver. UC1617 Datasheet
Ultra-Low Power 128COM x 128SEG Matrix Passive LCD Controller-Driver
|Total Page||3 Pages|
128x128 STN Controller-Driver
Single-Chip, Ultra-Low Power
128COM x 128SEG Matrix
Passive LCD Controller-Driver
UC1617s is an advanced high-voltage mixed-signal CMOS IC,
especially designed for the display needs of low power hand-
This chip employs UltraChip’s unique DCC (Direct Capacitor
Coupling) driver architecture and FRM (Frame Rate
Modulation) gray-shade modulation scheme to achieve near
crosstalk free images, with well balanced gray shades.
In addition to low power COM and SEG drivers, UC1617s
contains all necessary circuits for high-V LCD power supply,
bias voltage generation, temperature compensation, timing
generation and graphics data memory.
Advanced circuit design techniques are employed to minimize
external component counts and reduce connector size while
achieving extremely low power consumption.
• Cellular Phones and other battery operated palm top
devices or portable Instruments
• Single chip controller-driver for 128x128 matrix STN
LCD with 4 gray shades and B/W Mode.
• A software-readable ID pin and an MTP programmable
ID bit to support configurable vender identification.
• Partial scroll function and programmable data update
window to support flexible manipulation of screen data.
• Support both row ordered and page_c (page column)
ordered display buffer RAM access.
• Support industry standard 2-wire, 3-wire, 4-wire serial
buses (I2C, S8, S9) and 8-bit parallel buses (8080 or
• Special driver structure and gray shade modulation
scheme. Consistent low power consumption under all
• Fully programmable Mux Rate, partial display window,
Bias Ratio and Line Rate allow many flexible power
• Four software programmable frame rates up to 201Hz.
Support the use of fast Liquid Crystal material for
speedy LCD response.
• Software programmable 4 temperature compensation
• On-chip Power-ON Reset and Software RESET
command, make RST pin optional.
• Self-configuring 9x charge pump with on-chip pumping
capacitors. Only 3 external capacitors are required to
• Flexible data addressing/mapping schemes to support
wide ranges of software models and LCD layout
• Very low pin count (9~10 pins with S8, S9, or I2C) allows
exceptional image quality in COG format on
conventional ITO glass.
• Many on-chip and I/O pad layout features to support
optimized COG applications.
• VDD (digital) range (Typ.) : 1.8V ~ 3.3V
VDD (analog) range (Typ.) : 2.7V ~ 3.3V
LCD VOP range:
6.0V ~ 15V
• Available MTP trimming support precise LCD contrast
• Available in gold bump dies
Bump surface: 2,001 µM2
128x128 STN Controller-Driver
Yes Gold bumped die
Yes Gold bumped die, Bump Height 12uM
For improved readability, the specification contains many application data points. When application information is given, it is advisory and does
not form part of the specification for the device.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing. There is no post waffle saw/pack testing
performed on individual die. Although the latest processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers, UltraChip
has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the responsibility of the customer to test
and qualify their applications in which the die is to be used. UltraChip assumes no liability for device functionality or performance of the die or
systems after handling, packing or assembly of the die.
MTP LIGHT SENSITIVITY
The MTP memory cell is sensitive to photon excitation. Under extended exposure to strong ambient light, the MTP cells can lose its content
before the specified memory retention time span. The system designer is advised to provide proper light shields to realize full MTP content
USE OF I2C
The implementation of I2C is already included and tested in all silicon.
LIFE SUPPORT APPLICATIONS
These devices are not designed for use in life support appliances, or systems where malfunction of these products can reasonably be expected to
result in personal injuries. Customer using or selling these products for use in such applications do so at their own risk.
UltraChip believes the information contained in this document to be accurate and reliable. However, it is subject to change without notice. No
responsibility is assumed by UltraChip for its use, nor for infringement of patents or other rights of third parties. No part of this publication may be
reproduced, or transmitted in any form or by any means without the prior consent of UltraChip Inc. UltraChip's terms and conditions of sale apply
at all times.
UltraChip Inc. (Headquarter)
4F, No. 618, Recom Road,
Neihu District, Taipei 114,
Taiwan, R. O. C.
Tel: +886 (2) 8797-8947
Fax: +886 (2) 8797-8910
Sales e-mail: email@example.com
Web site: http://www.ultrachip.com
|Features||Datasheet pdf ULTRACHIP ©1999~2012 UC1617S_A1.2 128x 128 STN Controller-Driver UC1617 Singl e-Chip, Ultra-Low Power 128COM x 128SEG Matrix Passive LCD Controller-Driver INTRODUCTION UC1617s is an advanced hig h-voltage mixed-signal CMOS IC, especia lly designed for the display needs of l ow power handheld devices. This chip em ploys UltraChip’s unique DCC (Direct Capacitor Coupling) driver architecture and FRM (Frame Rate Modulation) gray-s hade modulation scheme to achieve near crosstalk free images, with well balanc ed gray shades. In addition to low powe r COM and SEG drivers, UC1617s contains all necessary circuits for high-V LCD power supply, bias voltage generation, temperature compensation, timing genera tion and graphics data memory. Advanced circuit design techniques are employed to minimize external component counts and reduce connector size while achievi ng extremely low power consumption. MAI N APPLICATIONS • Cellular Phones and other battery operated palm top devices or portable Instruments.|
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