Optocouplers. HCPL-5700 Datasheet

HCPL-5700 Datasheet PDF


Part

HCPL-5700

Description

High Gain Optocouplers

Manufacture

Broadcom

Page 14 Pages
Datasheet
Download HCPL-5700 Datasheet


HCPL-5700 Datasheet
6N140A, HCPL-675x, 83024, HCPL-570x,
HCPL-177K, 5962-89810, HCPL-573x,
HCPL-673x, 5962-89785, 5962-98002 1
Hermetically Sealed, Low IF, Wide VCC, High Gain
Optocouplers
Data Sheet
Description
These units are single, dual, and quad channel, hermetically
sealed optocouplers. The products are capable of operation
and storage over the full military temperature range and can
be purchased as either commercial product or with full
MIL-PRF-38534 Class Level H or K testing or from the
appropriate DLA Standard Microcircuit Drawing (SMD). All
devices are manufactured and tested on a MIL-PRF-38534
certified line, and Class H and K devices are included in the DLA
Qualified Manufacturers List QML-38534 for Hybrid
Microcircuits.
Each channel contains a GaAsP light emitting diode that is
optically coupled to an integrated high gain photon detector.
The high gain output stage features an open collector output,
providing both lower saturation voltage and higher signaling
speed than possible with conventional photo-Darlington
optocouplers. The shallow depth and small junctions offered
by the IC process provides better radiation immunity than
conventional photo transistor optocouplers.
The supply voltage can be operated as low as 2.0V without
adversely affecting the parametric performance.
These devices have a 300% minimum CTR at an input current
of only 0.5 mA making them ideal for use in low input current
applications such as MOS, CMOS, low power logic interfaces or
line receivers. Compatibility with high-voltage CMOS logic
systems is assured by specifying ICCH and IOH at 18 Volts.
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
1. See Selection Guide–Package Styles and Lead Configuration
Options for available extensions.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five hermetically sealed package configurations
Performance guaranteed over full military temperature
range: –55°C to +125°C
Low input current requirement: 0.5 mA
High current transfer ratio: 1500% typical at IF = 0.5 mA
Low output saturation voltage: 0.11V typical
1500 Vdc withstand test voltage
High radiation immunity
6N138/9, HCPL-2730/31 function compatibility
Reliability data
Applications
Military and aerospace
High reliability systems
Microprocessor system interface
Transportation, medical, and life critical systems
Isolated input line receiver
EIA RS-232-C line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Current loop receiver
System test equipment isolation
Process control input/output isolation
Broadcom
-1-

HCPL-5700 Datasheet
6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x,
5962-89785, 5962-98002
Data Sheet
Functional Diagram
Multiple channel devices available.
18
27
36
45
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
NOTE The connection of a 0.1-μF bypass capacitor
between VCC and GND is recommended.
Functional Diagram
Package styles for these parts are 8-pin and 16-pin DIP through
hole (case outlines P and E respectively), 16-pin DIP flat pack
(case outline F), and leadless ceramic chip carrier (case outline
2). Devices may be purchased with a variety of lead bend and
plating options. See Selection Guide–Package Styles and Lead
Configuration Options for details. Standard Military Drawing
(SMD) parts are available for each package and lead style.
Because the same electrical die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are similar for all parts
except as noted. Additionally, the same package assembly
processes and materials are used in all devices. These
similarities justify the use of a common data base for die
related reliability and certain limited radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Part Number and Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dippedb
Butt Cut/Gold Platea
Gull Wing/Solderedb
Crew Cut/Gold Platea
Class H SMD Part Number
Prescript for all below
Gold Platea
Solder Dippedb
16-pin DIP
Through Hole
4
VCC, GND
8-pin DIP
Through Hole
1
None
8-pin DIP
Through Hole
2
VCC, GND
16-pin Flat Pack 20-Pad LCCC
Unformed Leads
4
VCC, GND
Surface Mount
2
None
6N140A
6N140A/883B
HCPL-177K
Gold Platea
Option #200
Option #100
Option #300
Option #600
HCPL-5700
HCPL-5701
HCPL-570K
Gold Platea
Option #200
Option #100
Option #300
Option #600
HCPL-5730
HCPL-5731
HCPL-573K
Gold Platea
Option #200
Option #100
Option #300
Option #600
HCPL-6750
HCPL-6751
HCPL-675K
Gold Platea
HCPL-6730
HCPL-6731
HCPL-673K
Solder Padsb
None
8302401EC
8302401EA
5962-
8981001PC
8981001PA
5962-
8978501PC
8978501PA
None
8302401FC
5962-
89785022A
Broadcom
-2-


Features Datasheet pdf 6N140A, HCPL-675x, 83024, HCPL-570x, HCP L-177K, 5962-89810, HCPL-573x, HCPL-673 x, 5962-89785, 5962-98002 1 Hermeticall y Sealed, Low IF, Wide VCC, High Gain O ptocouplers Data Sheet Description The se units are single, dual, and quad cha nnel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temp erature range and can be purchased as e ither commercial product or with full M IL-PRF-38534 Class Level H or K testing or from the appropriate DLA Standard M icrocircuit Drawing (SMD). All devices are manufactured and tested on a MIL-PR F-38534 certified line, and Class H and K devices are included in the DLA Qual ified Manufacturers List QML-38534 for Hybrid Microcircuits. Each channel cont ains a GaAsP light emitting diode that is optically coupled to an integrated h igh gain photon detector. The high gain output stage features an open collecto r output, providing both lower saturati on voltage and higher signaling speed than possible with conven.
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