Reduction IC. SEMI8312H Datasheet

SEMI8312H IC. Datasheet pdf. Equivalent

SEMI8312H Datasheet
Recommendation SEMI8312H Datasheet
Part SEMI8312H
Description General Purpose Peak EMI Reduction IC
Feature SEMI8312H; SEMI8312H General Purpose Peak EMI Reduction IC Functional Description Making Diagrams SEMI8312H .
Manufacture Sursemi
Datasheet
Download SEMI8312H Datasheet




Sursemi SEMI8312H
SEMI8312H
General Purpose Peak EMI Reduction IC
Functional Description
Making Diagrams
SEMI8312H is a versatile, 3.3 V Timing SafePeak EMI
reduction IC.SEMI8312H accepts an input clock either from a
fundamental Crystal or from an external reference (AC or DC coupled
to XIN/CLKIN) and locks on to it delivering a 1x modulated clock
output. SEMI8312H has a SSON pin for enabling and disabling
Spread Spectrum function.
SEMI8312H has an SSEXTR pin to select different deviations
depending upon the value of an external resistor connected between
SSEXTR and GND. Modulation Rate (MR) control selects one of the
two different Modulation Rates.
SEMI8312H operates from a 3.3 V supply, and is available in an
8pin, WDFN(2 mm x 2 mm) package.
WDFN8
CASE 511AQ
DA = Specific Device Code
M = Date Code
G = PbFree Device
(Note: Microdot may be in either location)
General Features
1x, LVCMOS Peak EMI Reduction
Input frequency:
15 MHz 50 MHz
Output frequency:
15 MHz 50 MHz
Analog Deviation Selection
ModRate selection option
Spread Spectrum Enable/Disable
Supply Voltage: 3.3 V $ 0.3 V
8pin, WDFN 2 mm x 2 mm (TDFN) Package
These Devices are PbFree, Halogen Free/BFR Free and are
RoHS Compliant
Applications
Pin Configuration
XIN/CLKIN 1
XOUT 2
SSON 3
GND 4
SEMI8312H
8 VDD
7 SSEXTR
6 MR
5 ModOUT
SEMI8312H is targeted for consumer electronics application like
DDPiFm, MenFPs.ions
Rev. 1_Jan, 2015
1 of 6
www.sursemi.com



Sursemi SEMI8312H
SSON
MR
VDD
SEMI8312H
XIN/CLKIN
XOUT
Crystal
Oscillator
PLL
ModOUT
GND
SSEXTR
Figure 1. Block Diagram
Table 1.Pin Description
Pin#
1
2
3
Pin Name
XIN / CLKIN
XOUT
SSON
4 GND
5 ModOUT
6 MR
7 SSEXTR
8 VDD
Type
I
O
I
P
O
I
I
P
Description
Crystal connection or External reference clock input.
Crystal connection. If using an external reference, this pin should be left open.
Spread Spectrum ON/OFF. Spread Spectrum function enabled when HIGH, disabled when
LOW. Has an internal pullup resistor.
Ground
Modulated clock output
Modulation Rate Select. When LOW selects Low Modulation Rate. Selects High Modulation
Rate when pulled HIGH. Has an internal pullup resistor.
Analog Deviation Selection through external resistor to GND.
3.3 V supply Voltage.
Table 2.Operating Conditions
Symbol
VDD
TA
CL
CIN
Supply Voltage
Operating Temperature
Load Capacitance
Input Capacitance
Table 3.Absolute Maximum Rating
Parameter
Min Max Unit
3 3.6 V
0 70 °C
10 pF
7 pF
Symbol
Parameter
Rating
Unit
VDD, VIN
Voltage on any input pin with respect to Ground
0.5 to +4.6
V
TSTG
Storage Temperature
65 to +125
°C
Ts Max. Soldering Temperature (10 sec)
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
Rev. 1_Jan, 2015
2 of 6
www.sursemi.com



Sursemi SEMI8312H
SEMI8312H
Table 3.Absolute Maximum Rating
Symbol
Parameter
Rating
Unit
TJ Junction Temperature
150 °C
TDV Static Discharge Voltage (As per JEDEC STD22A114B)
2 kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
Table 4.DC Electrical Characteristics
Symbol
VDD
VIL
VIH
IIL
IIH
VOL
VOH
ICC
IDD
Zo
Parameter
Supply Voltage
Input LOW Voltage
Input HIGH Voltage
Input LOW Current
Input HIGH Current
Output LOW Voltage
Output HIGH Voltage
Static Supply Current
Dynamic Supply Current
Output Impedance
Test Conditions
VIN = 0 V
VIN = VDD
IOL = 8 mA
IOH = 8 mA
XIN / CLKIN pulled low
Unloaded Output
Min Typ Max Unit
3.0 3.3 3.6
V
0.8 V
2.0 V
25 mA
25 mA
0.4 V
2.4 V
50 mA
20 mA
30 W
Table 5.Switching Characteristcs
Parameter
Test Conditions
Input Frequency* / ModOUT
Duty Cycle (Notes 1 and 2)
Output Rise Time (Notes 1 and 2)
Measured at VDD / 2
Measured between 20% to 80%
Output Fall Time (Notes 1 and 2)
Measured between 80% to 20%
CycletoCycle Jitter (Note 2)
Unloaded output with SSEXTR OPEN @ 27 MHz
PLL Lock Time (Note 2)
Stable power supply, valid clock presented on XIN / CLKIN
*Functionality with Crystal is guaranteed by design and characterization. Not tested in production.
1. All parameters are specified with10 pF loaded outputs.
2. Parameter is guaranteed by design and characterization. Not tested in production.
Min Typ Max
15 50
45 50 55
1.8
1.6
$150 $250
3
Unit
MHz
%
ns
ns
ps
ms
Rev. 1_Jan, 2015
3 of 6
www.sursemi.com







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