Flash Memory. P25Q11H Datasheet

P25Q11H Memory. Datasheet pdf. Equivalent

P25Q11H Datasheet
Recommendation P25Q11H Datasheet
Part P25Q11H
Description Serial Multi I/O Flash Memory
Feature P25Q11H; P25Q21H/11H/06H Datasheet P25Q21H/11H/06H Ultra Low Power, 2M/1M/512K-bit Serial Multi I/O Flash Mem.
Manufacture Puya
Datasheet
Download P25Q11H Datasheet




Puya P25Q11H
P25Q21H/11H/06H Datasheet
P25Q21H/11H/06H
Ultra Low Power, 2M/1M/512K-bit
Serial Multi I/O Flash Memory Datasheet
Dec. 25, 2017
Performance Highlight
Wide Supply Range from 2.3 to 3.6V for Read, Erase and Program
Ultra Low Power consumption for Read, Erase and Program
X1, X2 and X4 Multi I/O Support
High reliability with 100K cycling and 20 Year-retention
Puya Semiconductor (Shanghai) Co., Ltd
Puya Semiconductor
Page 1 of 74



Puya P25Q11H
P25Q21H/11H/06H Datasheet
Contents
1 Overview........................................................................................................................................................4
2 Description.....................................................................................................................................................5
3 Pin Definition .................................................................................................................................................6
3.1 Pin Configurations .............................................................................................................................6
3.2 Pin Descriptions.................................................................................................................................6
4 Block Diagram ...............................................................................................................................................7
5 Electrical Specifications.................................................................................................................................8
5.1 Absolute Maximum Ratings ...............................................................................................................8
5.2 DC Characteristics.............................................................................................................................9
5.3 AC Characteristics .......................................................................................................................... 10
5.4 AC Characteristics for Program and Erase .....................................................................................11
5.5 Operation Conditions ...................................................................................................................... 13
6 Data Protection........................................................................................................................................... 15
7 Memory Address Mapping.......................................................................................................................... 19
8 Device Operation........................................................................................................................................ 20
9 Hold Feature............................................................................................................................................... 22
10 Commands ......................................................................................................................................... 23
10.1 Commands listing ........................................................................................................................... 23
10.2 Write Enable (WREN)..................................................................................................................... 26
10.3 Write Disable (WRDI)....................................................................................................................... 26
10.4 Write Enable for Volatile Status Register ....................................................................................... 27
10.5 Read Status Register (RDSR).......................................................................................................... 27
10.6 Read Configure Register (RDCR) .................................................................................................... 29
10.7 Active Status Interrupt (ASI) ........................................................................................................... 30
10.8 Write Status Register (WRSR) ......................................................................................................... 31
10.9 Write Configure Register (WRCR).................................................................................................... 31
10.10 Read Data Bytes (READ)................................................................................................................. 32
10.11 Read Data Bytes at Higher Speed (FAST_READ)............................................................................ 33
10.12 Dual Read Mode (DREAD) .............................................................................................................. 34
10.13 2 X IO Read Mode (2READ) ............................................................................................................ 35
10.14 2 X IO Read Performer Enhance Mode ............................................................................................ 36
10.15 Quad Read Mode (QREAD)............................................................................................................. 37
10.16 4 X IO Read Mode (4READ) ............................................................................................................ 38
10.17 4 X IO Read Performance Enhance Mode ....................................................................................... 39
10.18 Burst Read....................................................................................................................................... 40
10.19 Page Erase (PE).............................................................................................................................. 41
10.20 Sector Erase (SE) ............................................................................................................................ 41
10.21 Block Erase (BE32K) ....................................................................................................................... 42
10.22 Block Erase (BE).............................................................................................................................. 42
10.23 Chip Erase (CE)............................................................................................................................... 43
10.24 Page Program (PP).......................................................................................................................... 44
10.25 Dual Input Page Program (DPP) ...................................................................................................... 45
10.26 Quad Page Program (QPP) ............................................................................................................. 46
10.27 Erase Security Registers (ERSCUR)................................................................................................ 47
10.28 Program Security Registers (PRSCUR) ........................................................................................... 48
10.29 Read Security Registers (RDSCUR) ................................................................................................ 49
10.30 Deep Power-down (DP) ................................................................................................................... 50
10.31 Release form Deep Power-Down (RDP), Read Electronic Signature (RES)...................................... 50
10.32 Read Electronic Manufacturer ID & Device ID (REMS) ..................................................................... 52
10.33 Dual I/O Read Electronic Manufacturer ID & Device ID (DREMS) .................................................... 53
Puya Semiconductor
Page 2 of 74



Puya P25Q11H
P25Q21H/11H/06H Datasheet
10.34 Quad I/O Read Electronic Manufacturer ID & Device ID (QREMS)................................................... 54
10.35 Read Identification (RDID)................................................................................................................ 55
10.36 Program/Erase Suspend/Resume.................................................................................................... 56
10.37 Erase Suspend to Program .............................................................................................................. 57
10.38 Program Resume and Erase Resume.............................................................................................. 58
10.39 No Operation (NOP) ........................................................................................................................ 58
10.40 Software Reset (RSTEN/RST) ......................................................................................................... 59
10.41 Read Unique ID (RUID) ................................................................................................................... 60
10.42 Read SFDP Mode (RDSFDP) .......................................................................................................... 61
11 Ordering Information........................................................................................................................... 66
12 Package Information........................................................................................................................... 67
12.1 8-Lead SOP(150mil) ....................................................................................................................... 67
12.2 8-Lead SOP(208mil) ....................................................................................................................... 68
12.3 8-Lead TSSOP ............................................................................................................................... 69
12.4 8-Land USON(3x2x0.55mm) .......................................................................................................... 70
12.5 8-Land USON(3x2x0.45mm) .......................................................................................................... 71
12.6 8-Land USON(3x4x0.55mm) .......................................................................................................... 72
12.7 8-Land WSON(6x5mmx0.75) ......................................................................................................... 73
13 Revision History.................................................................................................................................. 74
Puya Semiconductor
Page 3 of 74







@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)