ESD Protection Diodes with Ultra−Low
The ESD5L is designed to protect voltage sensitive components that
require ultra−low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as USB 2.0 high speed and
antenna line applications.
• Ultra Low Capacitance 0.5 pF
• Low Clamping Voltage
• Stand−off Voltage: 3.3 V
• Low Leakage
• Response Time is Typically < 1.0 ns
• IEC61000−4−2 Level 4 ESD Protection
• This is a Pb−Free Device
• S- Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101
Qualified and PPAP Capable.
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
IEC 61000−4−2 (ESD)
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
−55 to +150
−55 to +125
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
PIN 1. CATHODE