Film Resistor. CR0603-PF Datasheet

CR0603-PF Resistor. Datasheet pdf. Equivalent


Part CR0603-PF
Description Ultra-Low Lead Content Thick Film Resistor
Feature HALORGoEHNS FC&ROEME*P*LI*ANT** *RoHS COMPLIANT 102 Features n Ultra-low lead (Pb) content* n G.
Manufacture BOURNS
Datasheet
Download CR0603-PF Datasheet


HALORGoEHNS FC&ROEME*P*LI*ANT** *RoHS COMPLIANT 102 Featu CR0603-PF Datasheet
Recommendation Recommendation Datasheet CR0603-PF Datasheet




CR0603-PF
Features
n Ultra-low lead (Pb) content*
n Green technology
n High reliability and stability
n Thick film paste on high grade ceramic
substrate
n RoHS compliant** without exemptions
n Halogen free***
Applications
n General purpose
n Consumer
n Industrial
n Telecommunications
n Computer technology
CR-PF Series Ultra-Low Lead Content Thick Film Resistor
Electrical Characteristics
Characteristic
Power Rating @ 70 °C
Operating Temperature Range
Derated to Zero Load at
Maximum Working Voltage
Maximum Overload Voltage
Resistance Range
(±1 %, E24 + E96 Series)
Resistance Range
(±5 %, E24 Series)
Zero Ohm Jumper ≤ 0.05 W
Rated/Maximum Current
CR0402-PF
0.0625 W
50 V
100 V
1 W ≤ R ≤ 9.76 W
-200 to +500 PPM/°C
10 W ≤ R ≤ 100 W
±200 PPM/°C
100 W ≤ R ≤ 1 MW
±100 PPM/°C
1 W ≤ R ≤ 9.1 W
-200 to +500 PPM/°C
Model
CR0603-PF
CR0805-PF
0.10 W
0.125 W
-55 °C to +155 °C
+155 °C
75 V
150 V
150 V
300 V
1 W ≤ R ≤ 9.76 W
±400 PPM/°C
10 W ≤ R ≤ 1 MW
±100 PPM/°C
-- --
1 MW ≤ R ≤ 10 MW
±200 PPM/°C
1 W ≤ R ≤ 9.1 W
±400 PPM/°C
10 W ≤ R ≤ 10 MW
±200 PPM/°C
1 A / 2.5 A
2A/5A
For Standard Values Used in Capacitors, Inductors and Resistors, click here.
CR1206-PF
0.25 W
200 V
400 V
--
Product Dimensions
Model
CR0402-PF
CR0603-PF
CR0805-PF
CR1206-PF
L W C d t
1.00 ± 0.10 0.50 ± 0.05 0.20 ± 0.10 0.25 ± 0.10 0.32 ± 0.05
(0.039 ± 0.004) (0.020 ± 0.002) (0.008 ± 0.004) (0.010 ± 0.004) (0.013 ± 0.002)
1.60 ± 0.10 0.80 ± 0.05 0.30 ± 0.20 0.30 ± 0.20 0.45 ± 0.10
(0.063 ± 0.004) (0.031 ± 0.002) (0.012 ± 0.008) (0.012 ± 0.008) (0.018 ± 0.04)
2.00 ± 0.10 1.25 ± 0.10 0.40 ± 0.20 0.40 ± 0.20 0.50 ± 0.10
(0.079 ± 0.004) (0.049 ± 0.004) (0.016 ± 0.008) (0.016 ± 0.008) (0.020 ± 0.004)
3.10 ± 0.10 1.55 ± 0.10 0.50 ± 0.30 0.40 ± 0.20 0.55 ± 0.10
(0.122 ± 0.004) (0.061 ± 0.004) (0.020 ± 0.012) (0.016 ± 0.008) (0.022 ± 0.004)
D IMENSIONS:
MM
(INCHES)
L
CC
dd
W
t
Recommended Solder Pad Layout
L
Model
CR0402-PF
CR0603-PF
CR0805-PF
CR1206-PF
a
0.5 ~ 0.6
(0.020 ~ 0.024)
0.7 ~ 0.9
(0.028 ~ 0.035)
1.0 ~ 1.4
(0.039 ~ 0.055)
2.0 ~ 2.4
(0.079 ~ 0.094)
b
1.4 ~ 1.6
(0.055 ~ 0.063)
2.0 ~ 2.2
(0.079 ~ 0.087)
3.2 ~ 3.8
(0.12C6 ~ 0.150)
4.4 ~ 5.0
(0.173 ~ 0.197)
c
0.4 ~ 0.6
(0.016 ~ 0W.024)
0.8 ~ 1.0
(0.031 ~ 0.039)
0.9 ~ 1.4
C (0.035 ~ 0t.055)
1.2 ~ 1.8
(0.047 ~ 0.071)
RESISTOR
c
a
b
D IMENSIONS:
MM
(INCHES)
*
**
Such products may contain trace amounts of lead of
RoHS Directive 2015/863, Mar 31, 2015 and Annex.
less
than
100
ppmd.
d
*** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is
1500 ppm or less.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.



CR0603-PF
CR-PF Series Ultra-Low Lead Content Thick Film Resistor
Construction
Sn PLATING
OVERCOAT
(BLACK)
CONDUCTOR
RESISTIVE
ELEMENT
CERAMIC SUBSTRATE
Ni PLATING
Rated Voltage
The rated voltage is calculated by the following formula:
V= P X R
V: Rated Voltage (V)
P: Rated Power (W)
R: Resistance Value (W)
Environmental Characteristics
Moisture Sensitivity Level................................................... 1
ESD Classification (HBM)................................................. 1A
Storage Conditions
Temperature............................................ +5 °C ~ +35 °C
Humidity..................................................... 40 % ~ 75 %
Shelf Life........................... 2 years from manufacturing date
Solder Recommendations...............................Reflow profile
(Solder: Sn96.5 / Ag3 / Cu05)
Derating Curve
100
70
80
60
40
20 155
0
-55 20 40 60 80 100 120 140 160
Ambient Temperature (°C)
Solder Reflow Recommendations
TP
TL
TS MAX.
TS MIN.
25 °C
RAMP-UP
tp
tL
ts
PREHEAT
CRITICAL ZONE
TL TO TP
RAMP-DOWN
t 25 *C TO PEAK
Time
8 MINUTES MAX.
Solder Profile
Average ramp-up rate
(Tsmax to Tp)
Preheat:
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (Tsmin to Tsmax) (ts)
Time maintained above:
- Temperature (TL)
- Time (TL)
Peak Temperature (Tp)
Time within +0/-5 °C of actual
Peak Temperature (Tp)2
Ramp-down rate
Time 25 °C to Peak
Temperature
Lead Free Assembly
3 °C / second max.
150 °C
200 °C
60~150 seconds
217 °C
60~120 seconds
260 °C
10 seconds
6 °C / second max.
8 minutes max.
Process
Description
1. Apply solder paste to
test board (8 - 10 mil thick)
Materials
Sn 96.5 / Ag 3.0 / Cu 0.5
Alloy water soluble or no
clean solder paste
Temperature
Room temperature
Time
Interval
Inspect solder joint to determine if solder joint is
acceptable (i.e. exhibits wetting of joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
A) Acceptable (see Figure 1)
(see note 1)
(1) The solder connection wetting angle (solder to
single sided epoxy glass
component and solder to PCB termination)
Specifications are subject to chan(gGe1w0)ith(UoLutanpoptriocvee. d)
does not exceed 90 °.
The device characteristics and parPaCmbeotearrsd ianptphriosxd. a4txa4sx.h0e6etinc.an and do vary
2U.sPelrasceshteosutldunvietsrifoynatoctbuoaal rddevic6e puenritfso/rbmoaarndce in their specific applications.
in
different
applications
and
actu(a2l)dSeovlidceerpbearlflosrtmhaatndcoe nmoatyvivoalaryteomveinritmimume.
electrical clearances and are attached
3. Ramp up
Convection oven
(see note 2)
2.5 °C ± 0.5 °/sec.
(soldered) to a metal surface.
4. Preheat (TS)
150 °C to 190 °C 90 ± 30 sec.
B) Unacceptable (see Figure 2)







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