Switching Characteristics. XC7S100 Datasheet

XC7S100 Characteristics. Datasheet pdf. Equivalent

XC7S100 Datasheet
Recommendation XC7S100 Datasheet
Part XC7S100
Description DC and AC Switching Characteristics
Feature XC7S100; Spartan-7 FPGAs Data Sheet: DC and AC Switching Characteristics DS189 (v1.9) March 13, 2019 Produc.
Manufacture Xilinx
Datasheet
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Xilinx XC7S100
Spartan-7 FPGAs Data Sheet:
DC and AC Switching Characteristics
DS189 (v1.9) March 13, 2019
Product Specification
Introduction
Spartan®-7 FPGAs are available in -2, -1, and -1L speed grades, with -2 having the highest performance.
The Spartan-7 FPGAs predominantly operate at a 1.0V core voltage. The -1L devices are screened for lower
maximum static power and can operate at lower core voltages for lower dynamic power than the -1
devices. The -1L devices operate only at VCCINT = VCCBRAM = 0.95V and have the same speed
specifications as the -1 speed grade.
Spartan-7 FPGA DC and AC characteristics are specified in commercial (C), industrial (I), and expanded (Q)
temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC
electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1Q
expanded speed grade device are the same as for a -1C commercial speed grade device). However, only
selected speed grades and/or devices are available in each temperature range. For example, the -1L speed
grade is only available in the industrial (I) temperature range.
All supply voltage and junction temperature specifications are representative of worst-case conditions.
The parameters included are common to popular designs and typical applications.
Available device and package combinations can be found in:
7 Series FPGAs Overview (DS180) [Ref 1]
XA Spartan-7 Automotive FPGA Data Sheet: Overview (DS171) [Ref 2]
This Spartan-7 FPGA data sheet, part of an overall set of documentation on the 7 series FPGAs, is available
on the Xilinx website at www.xilinx.com/documentation.
DC Characteristics
Table 1: Absolute Maximum Ratings(1)
Symbol
Description
FPGA Logic
VCCINT
VCCAUX
VCCBRAM
VCCO
VREF
Internal supply voltage.
Auxiliary supply voltage.
Supply voltage for the block RAM memories.
Output drivers supply voltage for HR I/O banks.
Input reference voltage.
Min
–0.5
–0.5
–0.5
–0.5
–0.5
Max
1.1
2.0
1.1
3.6
2.0
Units
V
V
V
V
V
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Xilinx XC7S100
Spartan-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 1: Absolute Maximum Ratings(1) (Cont’d)
Symbol
Description
Min Max Units
VIN(2)(3)(4)
I/O input voltage.
I/O input voltage (when VCCO = 3.3V) for VREF and differential I/O
standards except TMDS_33.(5)
–0.4
–0.4
VCCO + 0.55
2.625
V
V
VCCBATT
XADC
Key memory battery backup supply.
–0.5
2.0
V
VCCADC
XADC supply relative to GNDADC.
VREFP
XADC reference input relative to GNDADC.
Temperature
–0.5
–0.5
2.0
2.0
V
V
TSTG
TSOL
Tj
Storage temperature (ambient).
Maximum soldering temperature for Pb/Sn component bodies.(6)
Maximum soldering temperature for Pb-free component bodies.(6)
Maximum junction temperature.(6)
–65
150
+220
+260
+125
°C
°C
°C
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. The lower absolute voltage specification always applies.
3. For I/O operation, refer to the 7 Series FPGAs SelectIO Resources User Guide (UG471) [Ref 3].
4. The maximum limit applies to DC signals. For maximum undershoot and overshoot AC specifications, see Table 4.
5. See Table 9 for TMDS_33 specifications.
6. For soldering guidelines and thermal considerations, see the 7 Series FPGA Packaging and Pinout Specification (UG475) [Ref 4].
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Xilinx XC7S100
Spartan-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 2: Recommended Operating Conditions(1)(2)
Symbol
Description
Min
FPGA Logic
VCCINT(3)
For -2 and -1 (1.0V) devices: internal supply voltage.
For -1L (0.95V) devices: internal supply voltage.
0.95
0.92
VCCAUX
VCCBRAM(3)
VCCO(4)(5)
VIN(6)
Auxiliary supply voltage.
For -2 and -1 (1.0V) devices: block RAM supply voltage.
For -1L (0.95V) devices: block RAM supply voltage.
Supply voltage for HR I/O banks.
I/O input voltage.
I/O input voltage (when VCCO = 3.3V) for VREF and
differential I/O standards except TMDS_33.(7)
1.71
0.95
0.92
1.14
–0.20
–0.20
IIN(8)
VCCBATT(9)
XADC
Maximum current through any pin in a powered or unpowered
bank when forward biasing the clamp diode.
Battery voltage.
1.0
VCCADC
XADC supply relative to GNDADC.
VREFP
Externally supplied reference voltage.
Temperature
1.71
1.20
Junction temperature operating range for commercial (C)
temperature devices.
0
Tj
Junction temperature operating range for industrial (I)
temperature devices.
–40
Junction temperature operating range for expanded (Q)
temperature devices.
–40
Typ Max Units
1.00
1.05
0.95
0.98
1.80
1.89
1.00
1.05
0.95
0.98
– 3.465
– VCCO + 0.20
– 2.625
V
V
V
V
V
V
V
V
– 10 mA
– 1.89 V
1.80
1.25
1.89
1.30
V
V
– 85 °C
– 100 °C
– 125 °C
Notes:
1. All voltages are relative to ground.
2. For the design of the power distribution system consult the 7 Series FPGAs PCB Design Guide (UG483) [Ref 5].
3. If VCCINT and VCCBRAM are operating at the same voltage, VCCINT and VCCBRAM should be connected to the same supply.
4. Configuration data is retained even if VCCO drops to 0V.
5. Includes VCCO of 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, and 3.3V at ±5%.
6. The lower absolute voltage specification always applies.
7. See Table 9 for TMDS_33 specifications.
8. A total of 200 mA per bank should not be exceeded.
9. VCCBATT is required only when using bitstream encryption. If battery is not used, connect VCCBATT to either ground or VCCAUX.
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