Diode Arrays. SP3530 Datasheet

SP3530 Arrays. Datasheet pdf. Equivalent

SP3530 Datasheet
Recommendation SP3530 Datasheet
Part SP3530
Description TVS Diode Arrays
Feature SP3530; TVS Diode Arrays (SPA®®Diodes) Enhanced ESD Discrete TVS Series - SP3530 SP3530 0.3pF 22 kV unidirec.
Manufacture Littelfuse
Datasheet
Download SP3530 Datasheet




Littelfuse SP3530
TVS Diode Arrays (SPA®®Diodes)
Enhanced ESD Discrete TVS Series - SP3530
SP3530 0.3pF 22 kV unidirectional TVS diode
RoHS Pb GREEN ELV
Pinout
Bottom View
1
1
1
2
0201 DFN Bottom View
2
2
SOD882
Description
This SP3530 unidirectional diode is fabricated in a
proprietary silicon avalanche technology. This provides
a high level of protection for electronic equipment that
may be exposed to electrostatic discharges (ESD). This
robust component can safely absorb repetitive ESD strikes
above the maximum level specified in the IEC 61000-4-2
international standard (±8kV contact discharge) without
performance degradation. The extremely low loading
capacitance also makes it ideal for protecting high speed
signal pins such as V-By-One®, HDMI, USB3.0, USB2.0,
and IEEE 1394.
Features
• ESD, IEC 61000-4-2,
±22kV contact, ±22kV air
• EFT, IEC 61000-4-4, 40A
(tP=5/50ns)
• Lightning, IEC 61000-
4-5, 2nd edition, 2.5A
(tP=8/20μs)
• Low capacitance of 0.3pF
(TYP) at 3GHz
35• Low profile 0201 DFN
packages and SOD882
packages
• Facilitates excellent signal
integrity
• ELV Compliant
• AEC-Q101 qualified
• Halogen free, Lead free
and RoHS compliant
• Moisture Sensitivity Level
(MSL-1)
Functional Block Diagram
1
2
Unidirectional
Applications
• Ultra-high speed data
1 lines
• USB 3.1, 3.0, 2.0
• HDMI 2.0, 1.4a, 1.3
• DisplayPort(TM)
• V-by-One®
• LVDS interfaces
2
• C onsumer, mobile and
portable electronics
• Tablet PC and external
storage with high speed
interfaces
• Applications requiring
high ESD performance in
small packages
Bidirectional
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 07/03/17



Littelfuse SP3530
TVS Diode Arrays (SPA®®Diodes)
Enhanced ESD Discrete TVS Series - SP3530
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
IPP
TOP
TSTOR
Peak Current (tp=8/20μs)
Operating Temperature
Storage Temperature
2.5
-40 to 125
-55 to 150
A
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the component. This is a stress only rating and operation of the
component at these or any other conditions above those indicated in the operational
sections of this specification is not implied.
Electrical Characteristics - (TOP=25°C)
Parameter
Input Capacitance
Breakdown Voltage
Reverse Working Voltage
Reverse Leakage Current
Dynamic Resistance2
Clamping Voltage1
ESD Withstand Voltage1
Test Conditions
@ VR = 0V, f = 3GHz
VBR @ IT=1mA
IR≤1μA
IL @ VRWM=5.0V
TLP, tP=100ns, I/O to GND
VCL @ IPP=2.5A
IEC 61000-4-2 (Contact)
IEC 61000-4-2 (Air)
Note:
1. Parameter is guaranteed by design and/or component characterization.
2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Min
±22
±22
Typ
0.30
8.2
0.02
0.58
11.8
Max Units
pF
V
7.0 V
1 μA
Ω
V
kV
Clamping Voltage vs IPP
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
1
1.5 2
Peak Pulse Current - IPP(A)
2.5
8/20μs Pulse Waveform
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0 10.0 15.0 20.0
Time (μs)
25.0
30.0
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 07/03/17



Littelfuse SP3530
TVS Diode Arrays (SPA®®Diodes)
Enhanced ESD Discrete TVS Series - SP3530
Positive Transmission Line Pulsing (TLP) Plot
40
35
30
25
20
15
10
5
0
0
5 10 15 20 25 30 35
TLP Voltage (V)
IEC61000−4−2 +8 kV Contact ESD Clamping Voltage
Negative Transmission Line Pulsing (TLP) Plot
0
-5
-10
-15
-20
-25
-30
-35
-40
-18 -16 -14 -12 -10 -8 -6 -4 -2 0
TLP Voltage (V)
IEC61000−4−2 -8 kV Contact ESD Clamping Voltage
Soldering Parameters
Reflow Condition
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp (TL)
to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 07/03/17
TP
TL
TS(max)
TS(min)
25
Ramp-up
Preheat
tS
time to peak temperature
tP
Critical Zone
TL to TP
tL
Ramp-down
Time





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