PKFC08C Datasheet: 250W ENCAPSULATED FLIP CHIP TVS ARRAY





PKFC08C Datasheet PDF

Part Number PKFC08C
Description 250W ENCAPSULATED FLIP CHIP TVS ARRAY
Manufacture Protek Devices
Total Page 7 Pages
PDF Download Download PKFC08C Datasheet PDF

Features: 05180 Only One Name Means ProTek’Tion ™ 250W ENCAPSULATED FLIP CHIP TVS ARR AY PKFC3.3C - PKFC36C DESCRIPTION The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction t echnology for unmatched board-level tra nsient voltage protection against Elect rostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed speci fically for high-density circuit protec tion, this series meets the IEC 61000-4 -2 and 61000-4-4 requirements. These de vices are ideally suited for handheld d evices, PCMCIA and SMART cards. This se ries provides ESD protection greater th an 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the P KFCxxC series features superior clampin g performance, low leakage current char acteristics and a response time of less than a nanosecond. Their low inductanc e virtually eliminates overshoot voltag e due to package inductance. FEATURES • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Com.

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PKFC08C datasheet
Only One Name Means ProTek’Tion™
250W ENCAPSULATED FLIP CHIP TVS ARRAY
PKFC3.3C - PKFC36C
DESCRIPTION
The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electro-
static Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4
requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the PKF-
CxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually
eliminates overshoot voltage due to package inductance.
FEATURES
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
Chip Scale Package 0.050” x 0.030”
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration & Monolithic Structure
Protection for 1 Line
RoHS Compliant
REACH Compliant
MECHANICAL CHARACTERISTICS
Molded DFN-2 Package Configuration
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
APPLICATIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
CIRCUIT DIAGRAM
05180.R8 7/13
Page 1
ISO 9001: 2015 CERTIFIED

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