Operational Amplifiers. TLV2316 Datasheet

TLV2316 Datasheet PDF, Equivalent


Part Number

TLV2316

Description

1.8-V CMOS Operational Amplifiers

Manufacture

etcTI

Total Page 30 Pages
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TLV2316 Datasheet
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TLV316, TLV2316, TLV4316
SBOS752A – FEBRUARY 2016 – REVISED SEPTEMBER 2016
TLVx316
10-MHz, Rail-to-Rail Input/Output, Low-Voltage, 1.8-V CMOS Operational Amplifiers
1 Features
1 Unity-Gain Bandwidth: 10 MHz
• Low IQ: 400 µA/ch
– Excellent Power-to-Bandwidth Ratio
– Stable IQ Over Temperature and Supply
Range
• Wide Supply Range: 1.8 V to 5.5 V
• Low Noise: 12 nV/Hz at 1 kHz
• Low Input Bias Current: ±10 pA
• Offset Voltage: ±0.75 mV
• Unity-Gain Stable
• Internal RFI/EMI Filter
• Extended Temperature Range: –40°C to +125°C
2 Applications
• Battery-Powered Instruments:
– Consumer, Industrial, Medical
– Notebooks, Portable Media Players
• Sensor Signal Conditioning
• Barcode Scanners
• Active Filters
• Audio
RG RF
R1
VIN
VOUT
C1
f-3 dB =
1
2pR1C1
( (( (VOUT
VIN
=
1
+
RF
RG
1
1 + sR1C1
Single-Pole, Low-Pass Filter
3 Description
The TLV316 (single), TLV2316 (dual), and TLV4316
(quad) devices comprise a family of general-purpose,
low-power operational amplifiers. Features such as
rail-to-rail input and output swings, low quiescent
current (400 μA/ch typical) combined with a wide
bandwidth of 10 MHz, and very-low noise (12 nV/Hz
at 1 kHz) make this family attractive for a variety of
applications that require a good balance between
cost and performance. The low input bias current
supports operational amplifiers that are used in
applications with megaohm source impedances.
The robust design of the TLVx316 provides ease-of-
use to the circuit designer—a unity-gain stable,
integrated RFI/EMI rejection filter, no phase reversal
in overdrive condition, and high electrostatic
discharge (ESD) protection (4-kV HBM).
These devices are optimized for low-voltage
operation as low as 1.8 V (±0.9 V) and up to 5.5 V
(±2.75 V). This latest addition of low-voltage CMOS
operational amplifiers to the portfolio, in conjunction
with the TLVx313 and TLVx314 series, offer a family
of bandwidth, noise, and power options to meet the
needs of a wide variety of applications.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV316
SC70 (5)
SOT-23 (5)
1.25 mm × 2.00 mm
1.60 mm × 2.90 mm
TLV2316
VSSOP (8)
SOIC (8)
3.00 mm × 3.00 mm
3.91 mm × 4.90 mm
TLV4316
TSSOP (14)
SOIC (14)
4.40 mm × 5.00 mm
8.65 mm × 3.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
120 270
100 225
80 180
60 135
Phase
40 90
20
0
±20
1
VSS==22..7755VV
VSS==00..99VV
Gain
10 100 1k 10k 100k 1M
Frequency (Hz)
45
0
-45
10M 100M
C006
Low Supply Current (400 µA/Ch) for 10-MHz
Bandwidth
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV2316 Datasheet
TLV316, TLV2316, TLV4316
SBOS752A – FEBRUARY 2016 – REVISED SEPTEMBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information: TLV316 ................................... 7
7.5 Thermal Information: TLV2316 ................................. 7
7.6 Thermal Information: TLV4316 ................................. 7
7.7 Electrical Characteristics........................................... 8
7.8 Typical Characteristics .............................................. 9
7.9 Typical Characteristics ............................................ 10
8 Detailed Description ............................................ 13
8.1 Overview ................................................................. 13
8.2 Functional Block Diagram ....................................... 13
8.3 Feature Description................................................. 14
8.4 Device Functional Modes........................................ 15
9 Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 System Examples ................................................... 16
10 Power Supply Recommendations ..................... 17
10.1 Input and ESD Protection ..................................... 17
11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
11.2 Layout Example .................................................... 18
12 Device and Documentation Support ................. 19
12.1 Documentation Support ........................................ 19
12.2 Related Links ........................................................ 19
12.3 Community Resources.......................................... 19
12.4 Trademarks ........................................................... 19
12.5 Electrostatic Discharge Caution ............................ 20
12.6 Glossary ................................................................ 20
13 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
Changes from Original (February 2016) to Revision A
Page
• Added 14-pin SOIC package information to Device Information table .................................................................................. 1
• Added D package to PW package pinout drawing ................................................................................................................ 5
• Added D (SOIC) thermal values to Thermal Information: TLV4316 table ............................................................................. 7
2 Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TLV316 TLV2316 TLV4316


Features Datasheet pdf Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TLV316, TLV2316, TLV4316 SBO S752A – FEBRUARY 2016 – REVISED SEP TEMBER 2016 TLVx316 10-MHz, Rail-to-Rai l Input/Output, Low-Voltage, 1.8-V CMOS Operational Amplifiers 1 Features • 1 Unity-Gain Bandwidth: 10 MHz • Low IQ: 400 µA/ch – Excellent Power-to-B andwidth Ratio – Stable IQ Over Tempe rature and Supply Range • Wide Supply Range: 1.8 V to 5.5 V • Low Noise: 1 2 nV/√Hz at 1 kHz • Low Input Bias Current: ±10 pA • Offset Voltage: ± 0.75 mV • Unity-Gain Stable • Inter nal RFI/EMI Filter • Extended Tempera ture Range: –40°C to +125°C 2 Appli cations • Battery-Powered Instruments : – Consumer, Industrial, Medical – Notebooks, Portable Media Players • Sensor Signal Conditioning • Barcode Scanners • Active Filters • Audio RG RF R1 VIN VOUT C1 f-3 dB = 1 2p R1C1 ( (( (VOUT VIN = 1 + RF RG 1 1 + sR1C1 Single-Pole, Low-Pass Filter 3 Description The TLV316 (single), TLV2316 (dual), and TLV4316 (quad) .
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