motion sensor. LIS2DS12 Datasheet

LIS2DS12 sensor. Datasheet pdf. Equivalent

Part LIS2DS12
Description MEMS digital output motion sensor
Feature LIS2DS12 MEMS digital output motion sensor: ultra-low-power, high-performance 3-axis "pico" acceler.
Manufacture STMicroelectronics
Total Page 30 Pages
Datasheet
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LIS2DS12
LIS2DS12
MEMS digital output motion sensor:
ultra-low-power, high-performance 3-axis "pico" accelerometer
Datasheet - production data
Description
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Features
Supply voltage, 1.62 V to 1.98 V
Independent IOs supply (1.8 V) and supply
voltage compatible
Ultra-low power consumption
 2g/4g/8g/16g full scale
High-speed I2C/SPI digital output interface
Low noise
16-bit data output
Embedded temperature sensor
Self-test
256-level FIFO
10000 g high shock survivability
ECOPACK®, RoHS and “Green” compliant
Applications
Motion-activated functions and user interfaces
Gesture recognition and gaming
Pedometer, step detector and step counters
Display orientation
Sensor hub function
Tilt function
Tap/double-tap recognition
6D/4D orientation
Free-fall detection
Smartpower saving for handheld devices
Impact recognition and logging
The LIS2DS12 is an ultra-low-power, high-
performance three-axis linear accelerometer
belonging to the “pico” family which leverages on
the robust and mature manufacturing processes
already used for the production of micromachined
accelerometers.
The LIS2DS12 has user-selectable full scales of
2g/4g/8g/16g and is capable of measuring
accelerations with output data rates from 1 Hz to
6400 Hz.
The LIS2DS12 has an integrated 256-level first-
in, first-out (FIFO) buffer allowing the user to store
data in order to limit intervention by the host
processor.
The embedded self-test capability allows the user
to check the functioning of the sensor in the final
application.
The LIS2DS12 has a dedicated internal engine
architecture in order to process internally motion
and acceleration detection including free-fall,
wakeup, single and double-tap detection, activity-
inactivity, portrait and landscape detection, step
counter and step detection along with significant
motion detection.
The LIS2DS12 is available in a small thin plastic
land grid array package (LGA) and it is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1. Device summary
Order codes
Temperature
range [C]
Package
Packaging
LIS2DS12 -40 to +85 LGA-12
Tray
LIS2DS12TR
-40 to +85
LGA-12
Tape and
reel
September 2017
This is information on a product in full production.
DocID027753 Rev 7
1/69
www.st.com



LIS2DS12
Contents
Contents
LIS2DS12
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 12
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.1
2.4.2
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.6.1 Zero-g offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.6.2 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.6.3 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.7 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.8 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 Power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 Activity/Inactivity function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.3 Data stabilization time vs. ODR setting . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.4 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.4.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.4.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.4.3 Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.4.4 Continuous-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.4.5 Bypass-to-Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2/69 DocID027753 Rev 7





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