Switch. TPS22932B Datasheet

TPS22932B Datasheet PDF


Part

TPS22932B

Description

Ultralow rON Load Switch

Manufacture

etcTI

Page 29 Pages
Datasheet
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TPS22932B Datasheet
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TPS22932B
SLVS802C – AUGUST 2009 – REVISED MAY 2015
TPS22932B Low Input Voltage, Ultralow rON Load Switch With Configurable Enable Logic
and Controlled Slew-Rate
1 Features
1 Input Voltage: 1.1 V to 3.6 V
• Ultralow ON-Resistance
– rON = 55 mat VIN = 3.6 V
– rON = 65 mat VIN = 2.5 V
– rON = 75 mat VIN = 1.8 V
– rON = 115 mat VIN = 1.2 V
• 500-mA Maximum Continuous Switch Current
• Quiescent Current < 1 μA
• Shutdown Current < 1 μA
• Low Control Threshold Allows Use of 1.2-V, 1.8-V,
2.5-V, and 3.3-V Logic
• Configurable Enable Logic
• Controlled Slew Rate to Avoid Inrush Currents:
165 μs at 1.8 V
• Six-Terminal Wafer Chip Scale Package (DSBGA)
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
2 Applications
• PDAs
• Cell Phones
• GPS Devices
• MP3 Players
• Digital Cameras
• Peripheral Ports
• Portable Instrumentation
3 Description
The TPS22932B device is a low rON load switch with
controlled turnon. The device contains a P-channel
MOSFET that can operate over an input voltage
range of 1.1 V to 3.6 V.
The switch is controlled by eight patterns of 3-bit
input. The user can choose the logic functions MUX,
AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to VIN or GND. The control
pins can be connected to low-voltage GPIOs allowing
the switch to be controlled by either 1.2-V, 1.8-V, 2.5-
V, or 3.3-V logic signals while keeping extremely low
quiescent current.
A 120-on-chip load resistor is available for output
quick discharge when the switch is turned off. The
rise time (slew rate) of the device is internally
controlled to avoid inrush current: the rise time of
TPS22932B is 165 μs.
TPS22932B is available in a space-saving 6-pin
DSBGA (YFP with 0.4-mm pitch). The device is
characterized for operation over the free-air
temperature range of –40°C to 85°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS22932B
DSBGA (6)
0.80 mm × 1.20 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
VBATT
SMPS
(see Note A)
CIN = 1 µF CL
Typical Application
VIN
ON1
ON2
TPS22932B
VOUT
LOAD
CL RL
GND
ON3
GND
A. Switched-mode power supply
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS22932B Datasheet
TPS22932B
SLVS802C – AUGUST 2009 – REVISED MAY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 3
7.1 Absolute Maximum Ratings ...................................... 3
7.2 ESD Ratings.............................................................. 3
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 4
7.6 Switching Characteristics, 1.2 V ............................... 5
7.7 Switching Characteristics, 1.5 V ............................... 5
7.8 Switching Characteristics, 1.8 V ............................... 6
7.9 Switching Characteristics, 2.5 V ............................... 6
7.10 Switching Characteristics, 3 V ................................ 6
7.11 Switching Characteristics, 3.3 V ............................. 7
7.12 Typical Characteristics ............................................ 8
8 Parameter Measurement information ................ 13
9 Detailed Description ............................................ 14
9.1 Overview ................................................................. 14
9.2 Functional Block Diagram ....................................... 14
9.3 Feature Description................................................. 14
9.4 Device Functional Modes........................................ 15
10 Application and Implementation........................ 17
10.1 Application Information.......................................... 17
10.2 Typical Application ............................................... 17
11 Power Supply Recommendations ..................... 19
12 Layout................................................................... 19
12.1 Layout Guidelines ................................................. 19
12.2 Layout Example .................................................... 20
13 Device and Documentation Support ................. 21
13.1 Community Resources.......................................... 21
13.2 Trademarks ........................................................... 21
13.3 Electrostatic Discharge Caution ............................ 21
13.4 Glossary ................................................................ 21
14 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (August 2013) to Revision C
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
• Moved Operating free-air temperature values in Absolute Maximum Ratings to the Recommended Operating Conditions 4
Changes from Revision A (November 2009) to Revision B
Page
• Aligned package description throughout data sheet. ............................................................................................................. 1
2 Submit Documentation Feedback
Product Folder Links: TPS22932B
Copyright © 2009–2015, Texas Instruments Incorporated


Features Datasheet pdf Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TPS22932B SLVS802C – AUGUS T 2009 – REVISED MAY 2015 TPS22932B L ow Input Voltage, Ultralow rON Load Swi tch With Configurable Enable Logic and Controlled Slew-Rate 1 Features •1 I nput Voltage: 1.1 V to 3.6 V • Ultral ow ON-Resistance – rON = 55 mΩ at V IN = 3.6 V – rON = 65 mΩ at VIN = 2 .5 V – rON = 75 mΩ at VIN = 1.8 V rON = 115 mΩ at VIN = 1.2 V • 50 0-mA Maximum Continuous Switch Current • Quiescent Current < 1 μA • Shutd own Current < 1 μA • Low Control Thr eshold Allows Use of 1.2-V, 1.8-V, 2.5- V, and 3.3-V Logic • Configurable Ena ble Logic • Controlled Slew Rate to A void Inrush Currents: 165 μs at 1.8 V • Six-Terminal Wafer Chip Scale Packa ge (DSBGA) • ESD Performance Tested P er JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-D evice Model (C101) 2 Applications • P DAs • Cell Phones • GPS Devices • MP3 Players • Digital Cameras • Peripheral Ports • Portable Instrumentation 3.
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